H10W 20/222
Vias through non-semiconductor substrates
Official title: {Vias through non-semiconductor substrates, e.g. through-glass vias}
H10W20/222 (Vias through non-semiconductor substrates) appears on 4 US grants and 24 published applications in this corpus.
Search patents in H10W- Granted patents
- 4
- Published applications
- 24
- Assignees
- 13
- Inventors
- 96
- Latest grant
- 28 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2023 | 0 | 4 |
| 2024 | 0 | 2 |
| 2025 | 0 | 6 |
| 2026 | 4 | 12 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Integrated circuit structure and manufacturing method thereof28 Jul 2026US 12,696,794 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Replacement buried power rail19 May 2026US 12,635,491 B2International Business Machines Corporation
- Pillar based memory (MRAM) embedded within the buried power rail within a backside power distribution network24 Mar 2026US 12,588,216 B2International Business Machines Corporation
- Stacked transistors with metal vias17 Feb 2026US 12,557,637 B2International Business Machines Corporation
- Integrated circuit structure and manufacturing method thereof8 Oct 2026US 2026/0314480 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device1 Oct 2026US 2026/0305290 A1Renesas Electronics Corporation
- Conveying radio frequency signals through an interposer30 Jul 2026US 2026/0223686 A1NXP USA, Inc.
- Electrically conductive vias having end caps16 Jul 2026US 2026/0206612 A1Samtec, Inc.
- Power plane between stacked fets9 Jul 2026US 2026/0198290 A1International Business Machines Corporation
Most cited
By later US patents
No patent in this class has been cited by a later US patent yet.