H10P 95/60
Mechanical treatments
Official title: Mechanical treatments, e.g. by ultrasounds
H10P95/60 (Mechanical treatments) appears on 78 US grants and 103 published applications in this corpus.
Search patents in H10P- Granted patents
- 78
- Published applications
- 103
- Assignees
- 51
- Inventors
- 225
- Latest grant
- 30 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 1 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 0 |
| 2013 | 1 | 5 |
| 2014 | 2 | 8 |
| 2015 | 7 | 7 |
| 2016 | 6 | 8 |
| 2017 | 8 | 3 |
| 2018 | 2 | 4 |
| 2019 | 7 | 7 |
| 2020 | 5 | 9 |
| 2021 | 10 | 5 |
| 2022 | 3 | 10 |
| 2023 | 5 | 15 |
| 2024 | 4 | 6 |
| 2025 | 10 | 6 |
| 2026 | 3 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Separation method of bonded substrates30 Jun 2026US 12,672,496 B2Sky Tech Inc.
- Process of making components for electronic and optical devices using laser processing including ablation21 Apr 2026US 12,606,896 B2The United States of America as represented by the Secretary of the Air Force
- IC chip mounting device and IC chip mounting method3 Mar 2026US 12,568,787 B2Kabushiki Kaisha Sato
- Semiconductor wafer thinned by horizontal stealth lasing23 Dec 2025US 12,506,015 B2SanDisk Technologies LLC
- Semiconductor manufacturing apparatus and method of manufacturing semiconductor device25 Nov 2025US 12,482,669 B2Kioxia Corporation
- Reducing tensile film cracking13 Aug 2026US 2026/0239936 A1Lam Research Corporation
- Element transcription method and element transcription device25 Jun 2026US 2026/0182105 A1Panasonic Intellectual Property Management Co., Ltd.
- Semiconductor device and methods for manufacturing and inspecting the same28 May 2026US 2026/0150593 A1Highlight Tech Corp.
- Method of manufacturing semiconductor device and semiconductor device7 May 2026US 2026/0130150 A1Kabushiki Kaisha Toshiba
- Semiconductor device and method for manufacturing the same23 Apr 2026US 2026/0114011 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Methods of coating and singulating wafers16US 7,064,010 B2Micron Technology, Inc. · 2006
- Method for contacting a buried interconnect rail of an integrated circuit chip from the back side of the IC11US 10,985,057 B2Imec Vzw · 2021
- Minute transistor11US 8,841,675 B2Semiconductor Energy Laboratory Co.Ltd. · 2014
- Fabrication process of a semiconductor device using a slurry containing manganese oxide9US 5,763,325 AFujitsu Limited · 1998
- Slurry containing manganese oxide6US 5,877,089 AFujitsu Limited · 1999