Method of manufacturing semiconductor device and semiconductor device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorRiku KATAMAWARI
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Abstract
A method of manufacturing a semiconductor device according to an embodiment includes: forming a plurality of semiconductor elements in a device region of a first main surface of a semiconductor wafer; and forming a rim on the semiconductor wafer, the rim surrounding the plurality of semiconductor elements and having a rigidity in a Y-axis direction that is higher than a rigidity in an X-axis direction when a first warpage amount of the semiconductor wafer in the X-axis direction is smaller than a second warpage amount of the semiconductor wafer in the Y-axis direction.
Claims20
A method of manufacturing a semiconductor device, comprising:
- forming a plurality of semiconductor elements in a device region of a first main surface of a semiconductor wafer;
- and
- forming a rim on the semiconductor wafer, the rim surrounding the plurality of semiconductor elements and having a rigidity in a Y-axis direction that is higher than a rigidity in an X-axis direction if a first warpage amount of the semiconductor wafer in the X-axis direction is measured or estimated to be smaller than a second warpage amount of the semiconductor wafer in the Y-axis direction.
A semiconductor device comprising:
- a central portion including a device region in which a plurality of semiconductor elements are formed;
- and
- a rim, thicker than the central portion, configured to surround the central portion,
- wherein a width of the rim in an X-axis direction is greater than a width of the rim in a Y-axis direction.
A semiconductor device comprising:
- a central portion including a device region in which a plurality of semiconductor elements are formed;
- and
- a rim, thicker than the central portion, configured to surround the central portion,
- wherein the rim has a thickness at a portion intersecting with an X-axis that is greater than a thickness at a portion intersecting with a Y-axis.
Dependencies are inferred from the claim text.