IC chip mounting device and IC chip mounting method
AssigneeKabushiki Kaisha Sato
InventorYoshimitsu Maeda
Life of this patent
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Abstract
The present invention is an IC chip mounting apparatus including: a conveyor configured to convey an antenna continuous body on a conveying surface, the antenna continuous body having a base material and plural inlay antennas continuously formed on the base material; an IC chip placement unit configured to place an IC chip on a photo-curable adhesive that is located on a reference position of each antenna in the antenna continuous body; and a light irradiator configured to irradiate, with light, the adhesive of each antenna of the antenna continuous body that is conveyed by the conveyor, wherein the light irradiator is configured to irradiate the adhesive of each antenna with the light, while the IC chip on the adhesive is pressed to the antenna.
Claims20
An IC chip mounting apparatus comprising:
- a conveyor configured to convey an antenna continuous body on a conveying surface, the antenna continuous body having a base material and a plurality of inlay antennas continuously formed on the base material;
- an IC chip placement unit configured to place an IC chip on a photo-curable adhesive that is located on a reference position of each of the inlay antennas of the antenna continuous body;
- and
- a light irradiator configured to irradiate, with light, the photo-curable adhesive located on each of the inlay antennas of the antenna continuous body,
- wherein the light irradiator is configured to irradiate the photo-curable adhesive located on each of the inlay antennas with the light while the IC chip on the photo-curable adhesive is pressed to each of the inlay antennas.
An IC chip mounting apparatus comprising:
- a conveyor configured to convey an antenna continuous body on a conveying surface, the antenna continuous body having a base material and a plurality of inlay antennas continuously formed on the base material;
- an IC chip placement unit configured to place an IC chip on a thermosetting adhesive that is located on a reference position of each of the inlay antennas of the antenna continuous body;
- and
- a thermal curing unit configured to apply heat to the thermosetting adhesive located on the each of the inlay antennas of the antenna continuous body that is conveyed by the conveyor,
- wherein the thermal curing unit is configured to apply heat to the thermosetting adhesive located on each of the inlay antennas while the IC chip on the thermosetting adhesive is pressed to each of the inlay antennas.
An IC chip mounting method comprising:
- conveying an antenna continuous body on a conveying surface, the antenna continuous body having a base material and a plurality of inlay antennas continuously formed on the base material;
- placing an IC chip on a photo-curable adhesive that is located on a reference position of each of the inlay antennas of the antenna continuous body;
- and
- irradiating, with light, the photo-curable adhesive located on each of the inlay antennas of the antenna continuous body while pressing the IC chip on the photo-curable adhesive to each of the inlay antennas.
An IC chip mounting apparatus comprising:
- a light irradiator configured to irradiate, with light, an adhesive on which an IC chip is placed, the adhesive being applied on each of a plurality of antennas of an antenna continuous body;
- a press unit configured to press the IC chip on the adhesive to each of the antennas, wherein:
- the light irradiator is configured to irradiate the adhesive applied on each of the antennas with the light while the press unit presses the IC chip on the adhesive to each of the antennas, and
- the press unit is configured to transmit the light irradiated from the light irradiator while pressing the IC chip on the adhesive to each of the antennas so that the transmitted light irradiates the adhesive.
An IC chip mounting method comprising:
- pressing, with a press unit, an IC chip on an adhesive to an antenna of an antenna continuous body, the adhesive being applied on the antenna;
- and
- irradiating, with light, the adhesive of the antenna of the antenna continuous body while pressing the IC chip on the adhesive to the antenna with the press unit, wherein:
- the press unit transmits the light while pressing the IC chip on the adhesive to the antenna so that the transmitted light irradiates the adhesive.
Dependencies are inferred from the claim text.