Semiconductor device and methods for manufacturing and inspecting the same

Abstract

Disclosed are a semiconductor device and methods for manufacturing and inspecting the same. The manufacturing method comprises the steps of: providing at least one substrate; and performing a forming step for forming at least one microstructure on the substrate by utilizing a processing technique selected from a group consisting of a laser processing technique, a microwave processing technique, a radio frequency processing technique, an electrical discharge machining technique, a wet chemical processing technique, a mechanical processing technique, a plasma source processing technique, a particle beam processing technique, and a build-up processing technique. The microstructure is selected from the group consisting of a hole-shaped structure, a line structure, and an optical structure. The manufacturing method of the disclosure effectively improves processing efficiency and precision, and through the integration of diverse processing techniques combined with innovative substrate pre-processing and sidewall repair solutions, it enhances process flexibility, production efficiency, and structural reliability.

Dependencies are inferred from the claim text.