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US 5,877,089 AGranted
Slurry containing manganese oxide
AssigneeFujitsu Limited
InventorsSadahiro Kishii, Akiyoshi Hatada, Rintaro Suzuki, Hiroshi Horie, Yoshihiro Arimoto, Ko Nakamura
Life of this patent
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Abstract
A slurry contains MnO.sub.2 or other manganese oxide as a primary component of abrasive particles. Further, a polishing process using such a manganese oxide abrasive and a fabrication process of a semiconductor device using such a polishing process are disclosed.
Claims5
A slurry, comprising:
- abrasive particles of MnO.sub.2 ;
- a solvent in which said abrasive particles are dispersed;
- and
- an additive containing a benzene ring, added to said solvent.
1 more element
A slurry, comprising:
- abrasive particles of MnO.sub.2 ;
- a solvent of H.sub.2 O in which said abrasive particles are dispersed;
- and
- an additive added to said solvent;
- said additive being selected from a lactic acid and lactose.
2 more elements
Dependencies are inferred from the claim text.