Separation method of bonded substrates

A separation method of bonded substrates comprising:

• transporting a bonded substrate to a debonding device, and placing the bonded substrate on a breathable plate in the debonding device by a robot arm, wherein the bonded substrate comprises a stack of a wafer and a carrier substrate;
• separating the wafer and the carrier substrate of the bonded substrate through the debonding device, wherein the wafer is located on the breathable plate;
• transporting the wafer and the breathable plate to a cleaner by the robot arm for performing a cleaning process;
• transporting the wafer and the breathable plate to a rack of a relay device by the robot arm, wherein the relay device comprises at least one clamping unit;
• clamping the breathable plate by the clamping unit disposed on the rack;
• sucking the wafer on the breathable plate by a bernoulli arm to separate the wafer and the breathable plate;
• turning over the wafer sucked by the bernoulli arm, and then placing the wafer on a wafer rack of the relay device by the bernoulli arm;
• and
• taking the wafer out from the relay device by the robot arm.