H10P 95/08
Planarisation of organic insulating materials
Official title: {Planarisation of organic insulating materials}
H10P95/08 (Planarisation of organic insulating materials) appears on 868 US grants and 947 published applications in this corpus.
Search patents in H10P- Granted patents
- 868
- Published applications
- 947
- Assignees
- 248
- Inventors
- 2,105
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 3 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 4 | 0 |
| 1992 | 5 | 0 |
| 1993 | 3 | 0 |
| 1994 | 9 | 0 |
| 1995 | 10 | 0 |
| 1996 | 2 | 0 |
| 1997 | 5 | 0 |
| 1998 | 2 | 0 |
| 1999 | 4 | 0 |
| 2000 | 14 | 0 |
| 2001 | 14 | 6 |
| 2002 | 18 | 33 |
| 2003 | 27 | 32 |
| 2004 | 20 | 33 |
| 2005 | 24 | 36 |
| 2006 | 21 | 24 |
| 2007 | 20 | 47 |
| 2008 | 27 | 35 |
| 2009 | 20 | 28 |
| 2010 | 27 | 10 |
| 2011 | 23 | 13 |
| 2012 | 16 | 11 |
| 2013 | 16 | 20 |
| 2014 | 17 | 30 |
| 2015 | 25 | 61 |
| 2016 | 56 | 70 |
| 2017 | 62 | 79 |
| 2018 | 52 | 48 |
| 2019 | 65 | 68 |
| 2020 | 64 | 63 |
| 2021 | 46 | 50 |
| 2022 | 35 | 33 |
| 2023 | 28 | 32 |
| 2024 | 39 | 33 |
| 2025 | 28 | 32 |
| 2026 | 12 | 20 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Enhanced dry desmear equipment with protective film peeling capability for integrated circuits29 Sep 2026US 12,749,660 B2Intel Corporation
- Film forming method, article manufacturing method, supply device, film forming apparatus, and substrate4 Aug 2026US 12,699,317 B2Canon Kabushiki Kaisha
- Contact apparatus for arranging semiconductor devices4 Aug 2026US 12,701,949 B2Texas Instruments Incorporated
- Planarizing agent for forming organic film, composition for forming organic film, method for forming organic film, and patterning process23 Jun 2026US 12,663,717 B2Shin-Etsu Chemical Co., Ltd.
- Negative-tone organic dielectric with fine metal pillar resolution9 Jun 2026US 12,653,009 B2International Business Machines Corporation
- Method for manufacturing semiconductor device, and insulating resin material1 Oct 2026US 2026/0305434 A1Resonac Corporation
- Film forming method and article manufacturing method10 Sep 2026US 2026/0271683 A1Canon Kabushiki Kaisha
- Chemical mechanical polishing device and method for processing wafer using same6 Aug 2026US 2026/0231722 A1Samsung Electronics Co., Ltd.
- Polishing composition23 Jul 2026US 2026/0209550 A1Nitta Dupont Incorporated
- Processes for planarization of a semiconducting wafer substrate23 Jul 2026US 2026/0215235 A1
Most cited
By later US patents
- UV exposure for improving properties and adhesion of dielectric polymer films formed by chemical vapor deposition574US 6,284,050 B1Novellus Systems, Inc. · 2001
- Plasma curing of MSQ-based porous low-k film materials567US 6,759,098 B2Axcelis Technologies, Inc. · 2004
- Method of repairing a low dielectric constant material layer538US 6,521,547 B1United Microelectronics Corp. · 2003
- Method to plasma deposit on organic polymer dielectric film530US 7,163,721 B2Tegal Corporation · 2007
- Removal of carbon from an insulative layer using ozone528US 6,939,817 B2Micron Technology, Inc. · 2005