Negative-tone organic dielectric with fine metal pillar resolution

A method comprising:

• forming one or more metal pillars on a substrate, the substrate including a back-end-of-line structure, the structure including one or more metal lines;
• forming a negative-tone organic dielectric layer on top of and covering the one or more metal pillars and the substrate;
• planarizing the negative-tone organic dielectric layer to expose top surfaces of the one or more metal pillars;
• forming a resist mask on the negative-tone organic dielectric layer, the resist mask having openings that expose the top surfaces of the one or more metal pillars;
• and
• electroplating a redistribution layer in the openings of the resist mask, the redistribution layer including one or more metal contacts, the one or more metal contacts in direct contact with the one or more metal pillars.