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US 2026/0209550 A1Published application
Polishing composition
AssigneeNitta Dupont Incorporated
InventorsShuhei MATSUDA, Rina OGAWA
Life of this patent
Estimating the term…
Abstract
Provided is a polishing composition used for polishing a resin, the polishing composition including: water; alumina abrasive grains; and an anionic surfactant, in which the anionic surfactant has two or more benzene rings.
Claims5
A polishing composition used for polishing a resin, the polishing composition comprising:
- water;
- alumina abrasive grains;
- and an anionic surfactant, wherein
- the anionic surfactant has two or more benzene rings.
1 more element
Dependencies are inferred from the claim text.