H10P 76/2045
Electron beam lithography processes
Official title: {Electron beam lithography processes}
H10P76/2045 (Electron beam lithography processes) appears on 172 US grants and 142 published applications in this corpus.
Search patents in H10P- Granted patents
- 172
- Published applications
- 142
- Assignees
- 90
- Inventors
- 387
- Latest grant
- 21 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 5 | 0 |
| 1979 | 3 | 0 |
| 1980 | 2 | 0 |
| 1981 | 4 | 0 |
| 1982 | 5 | 0 |
| 1983 | 1 | 0 |
| 1984 | 4 | 0 |
| 1985 | 1 | 0 |
| 1986 | 3 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 3 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 3 | 0 |
| 1998 | 3 | 0 |
| 1999 | 1 | 0 |
| 2000 | 4 | 0 |
| 2001 | 4 | 2 |
| 2002 | 1 | 0 |
| 2003 | 0 | 6 |
| 2004 | 2 | 7 |
| 2005 | 6 | 6 |
| 2006 | 3 | 2 |
| 2007 | 4 | 4 |
| 2008 | 1 | 4 |
| 2009 | 3 | 4 |
| 2010 | 1 | 3 |
| 2011 | 2 | 2 |
| 2012 | 4 | 3 |
| 2013 | 3 | 3 |
| 2014 | 3 | 7 |
| 2015 | 7 | 14 |
| 2016 | 9 | 11 |
| 2017 | 10 | 17 |
| 2018 | 8 | 6 |
| 2019 | 16 | 8 |
| 2020 | 9 | 6 |
| 2021 | 7 | 11 |
| 2022 | 2 | 4 |
| 2023 | 8 | 2 |
| 2024 | 3 | 3 |
| 2025 | 3 | 1 |
| 2026 | 1 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Film-forming composition having a multiple bond21 Apr 2026US 12,607,936 B2Nissan Chemical Corporation
- Extreme ultraviolet (EUV) lithography using an intervening layer or a multi-layer stack with varying mean free paths for secondary electron generation29 Jul 2025US 12,372,872 B2Lam Research Corporation
- Method and system for fabricating unique chips using a charged particle multi-beamlet lithography system3 Jun 2025US 12,322,569 B2ASML Netherlands B. V.
- Conductive film, method for producing same, conductor, resist pattern formation method, and laminate25 Mar 2025US 12,260,969 B2Mitsubishi Chemical Corporation
- Method for reducing charging of semiconductor wafers10 Dec 2024US 12,165,867 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Resist underlayer film-forming composition8 Oct 2026US 2026/0310081 A1Nissan Chemical Corporation
- Methods and systems for directional processing6 Aug 2026US 2026/0227706 A1Tel Manufacturing and Engineering of America, Inc.
- Metal oxide resist pattern-forming organic resin composition30 Jul 2026US 2026/0217963 A1Nissan Chemical Corporation
- Resist underlayer film-forming composition23 Jul 2026US 2026/0211331 A1Nissan Chemical Corporation
- Composition for forming resist underlayer film containing acrylamide group11 Jun 2026US 2026/0161084 A1Nissan Chemical Corporation
Most cited
By later US patents
- Lithography patterning with a gas phase resist422US 10,018,920 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2018
- Method of molecular-scale pattern imprinting at surfaces209US 6,319,566 B12001
- Microelectronic shadow masking process for reducing punchthrough98US 4,394,182 ARockwell International Corporation · 1983
- Sequential infiltration synthesis for advanced lithography93US 8,980,418 B2Uchicago Argonne, LLC · 2015
- Variable thickness self-aligned photoresist process80US 4,231,811 AIntel Corporation · 1980