Methods and systems for directional processing

A method for processing a substrate, the method comprising:

• providing a substrate comprising a major surface and a mask layer disposed over the major surface;
• forming a first angle between a processing beam and a normal direction of the major surface;
• exposing the mask layer to the processing beam at the first angle using a first set of process parameters;
• rotating the substrate about an axis normal to the major surface;
• forming a second angle between the processing beam and the normal direction of the major surface;
• and
• exposing the mask layer to the processing beam at the second angle using a second set of process parameters.

A system for processing a substrate, the system comprising:

• a substrate holder disposed in a process chamber and configured to hold the substrate, the substrate comprising a major surface, and a mask layer disposed over the major surface, the mask layer comprising a feature;
• a processing beam source configured to emit a processing beam onto the substrate through a processing nozzle;
• and
• a controller coupled to the processing beam source, the substrate holder, and a memory storing instructions to be executed in the controller, wherein the instructions when executed cause the controller to:
• form a first angle between the processing beam and a normal direction of the major surface;
• expose the mask layer to the processing beam at the first angle using a first set of process parameters;
• form a second angle between the processing beam and the normal direction of the major surface, the second angle being different from the first angle;
• and
• expose the mask layer to the processing beam at the second angle using a second set of process parameters.