Film-forming composition having a multiple bond
AssigneeNissan Chemical Corporation
InventorsTomotada Hirohara, Mamoru Tamura
Life of this patent
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Abstract
A composition for forming a resist underlayer film that enables the formation of a desired resist pattern; and a method for producing a resist pattern and a method for producing a semiconductor device, each of which uses the composition for forming a resist underlayer film. (In formula (1), A1, A2, A3, A4, A5, and A6 each independently represent a hydrogen atom, methyl group, or ethyl group; Q1 represents a divalent organic group; R1 represents a tetravalent organic group; and R2 represents an alkenyl group or alkynyl group having 2-10 carbon atoms.) The film-forming composition contains a solvent and a polymer that has a unit structure given by formula (1).
Claims13
A film-forming composition comprising a solvent and a polymer having a unit structure represented by the following formula (1):
- wherein each of A1, A2, A3, A4, A5, and A6 independently represents a hydrogen atom, a methyl group, or an ethyl group;
- Q1 represents a divalent organic group;
- R1 represents a tetravalent organic group;
- and R2 represents an alkenyl group or alkynyl group having 2 to 10 carbon atoms.
Dependencies are inferred from the claim text.