H10P 72/135
Characterised by a material, a roughness, a coating or the like
Official title: {characterised by a material, a roughness, a coating or the like}
H10P72/135 (Characterised by a material, a roughness, a coating or the like) appears on 47 US grants and 46 published applications in this corpus.
Search patents in H10P- Granted patents
- 47
- Published applications
- 46
- Assignees
- 39
- Inventors
- 123
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 3 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 4 | 0 |
| 2001 | 4 | 0 |
| 2002 | 4 | 1 |
| 2003 | 1 | 2 |
| 2004 | 0 | 3 |
| 2005 | 0 | 1 |
| 2006 | 1 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 2 |
| 2010 | 1 | 0 |
| 2011 | 2 | 2 |
| 2012 | 1 | 1 |
| 2013 | 1 | 2 |
| 2014 | 0 | 2 |
| 2015 | 1 | 0 |
| 2016 | 1 | 3 |
| 2017 | 0 | 3 |
| 2018 | 4 | 6 |
| 2019 | 0 | 2 |
| 2020 | 2 | 2 |
| 2021 | 3 | 5 |
| 2022 | 3 | 0 |
| 2023 | 1 | 5 |
| 2024 | 3 | 3 |
| 2025 | 2 | 0 |
| 2026 | 2 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wafer boat and plate for wafer boat4 Aug 2026US 12,701,956 B2Hanwha Solutions Corporation
- Semiconductor device and methods of making and using an enhanced carrier to reduce electrostatic discharge24 Mar 2026US 12,588,463 B2STATS ChipPAC Pte. Ltd.
- Graphite disc9 Dec 2025US 12,494,392 B2Enkris Semiconductor, Inc.
- Wafer boat9 Sep 2025US 12,412,763 B2KYOCERA Corporation
- Fluidic assembly MicroLED mass transfer method29 Oct 2024US 12,132,034 B2eLux, Inc.
- Wafer boat device and plasma dissociation furnace tube system7 May 2026US 2026/0130168 A1Metal Industries Research & Development Centre
- Semiconductor Device and Methods of Making and Using an Enhanced Carrier to Reduce Electrostatic Discharge24 Oct 2024US 2024/0355655 A1STATS ChipPAC Pte. Ltd.
- Fluidic Assembly MicroLED Mass Transfer Method2 May 2024US 2024/0145443 A1eLux, Inc.
- Wafer boat and plate for wafer boat1 Feb 2024US 2024/0038560 A1Hanwha Solutions Corporation
- Substrate supports, semiconductor processing systems, and material layer deposition methods30 Nov 2023US 2023/0386874 A1ASM IP Holding B. V.
Most cited
By later US patents
- Reinforced carrier with embedded rigid insert97US 4,872,554 AFluoroware, Inc. · 1989
- Wafer carrier having both a rigid structure and resistance to corrosive environments27US 5,788,304 AMicron Technology, Inc. · 1998
- Method of fabricating silicon structures including fixtures for supporting wafers18US 6,455,395 B1Integrated Materials, Inc. · 2002
- Processing machine with lockdown rotor15US 6,370,791 B1Semitool, Inc. · 2002
- Compliant process cassette13US 6,041,938 ASCP Global Technologies, Inc. · 2000