Semiconductor Device and Methods of Making and Using an Enhanced Carrier to Reduce Electrostatic Discharge
AssigneeSTATS ChipPAC Pte. Ltd.
InventorsMoonSu Han, YoungJun Kim, DongChae Kim, Ilhan Jung, Cheolsoo Lee
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Abstract
A semiconductor device is made with a boat carrier including stainless steel. A Polytetrafluoroethylene (PTFE) layer is formed over the boat carrier. A semiconductor package substrate is disposed over the boat carrier. A manufacturing step is performed on the semiconductor package substrate. An electrostatic discharge (ESD) is imparted on the boat carrier during the manufacturing step. The semiconductor package substrate is protected from the ESD by the PTFE layer.
Claims25
A method of making a semiconductor device, comprising:
- providing a boat carrier including stainless steel;
- forming a Polytetrafluoroethylene (PTFE) layer over the boat carrier;
- disposing a semiconductor package substrate over the boat carrier;
- and
- performing a manufacturing step on the semiconductor package substrate, wherein an electrostatic discharge (ESD) is imparted on the boat carrier during the manufacturing step, and wherein the semiconductor package substrate is protected from the ESD by the PTFE layer.
A method of making a semiconductor device, comprising:
- providing a boat carrier including stainless steel;
- and
- forming a Polytetrafluoroethylene (PTFE) layer over the boat carrier.
A method of making a semiconductor device, comprising:
- providing a boat carrier including a conductive material;
- and
- forming an insulating layer over the boat carrier.
A semiconductor manufacturing device, comprising:
- a boat carrier including stainless steel;
- and
- a Polytetrafluoroethylene (PTFE) layer formed over the boat carrier.
Dependencies are inferred from the claim text.