Wafer boat device and plasma dissociation furnace tube system

A wafer boat device, comprising:

• a first positive electrode plate;
• a first negative electrode plate opposite to the first positive electrode plate;
• a plasma region disposed between the first positive electrode plate and the first negative electrode plate, wherein the plasma region comprises a plurality of second positive electrode plates and a plurality of second negative electrode plates;
• a coating region disposed between the first positive electrode plate and the first negative electrode plate, and separated from the plasma region by a first circuit breaking region, wherein the coating region comprises a plurality of third positive electrode plates and a plurality of third negative electrode plates, and each of the third positive electrode plates and the third negative electrode plates is configured to carry a plurality of cells;
• and
• a feed region disposed between the first positive electrode plate and the first negative electrode plate, and separated from the coating region by a second circuit breaking region, wherein the feed region comprises a plurality of fourth positive electrode plates and a plurality of fourth negative electrode plates, and the feed region is electrically connected to the plasma region,
• wherein all the second positive electrode plates and the second negative electrode plates, the third positive electrode plates and the third negative electrode plates, and the fourth positive electrode plates and the fourth negative electrode plates are arranged at intervals from each other in a staggered manner with the first positive electrode plate and the first negative electrode plate.