H10P 72/0428
Apparatus for mechanical treatment or grinding or cutting
Official title: {Apparatus for mechanical treatment or grinding or cutting}
H10P72/0428 (Apparatus for mechanical treatment or grinding or cutting) appears on 2,304 US grants and 3,003 published applications in this corpus.
Search patents in H10P- Granted patents
- 2,304
- Published applications
- 3,003
- Assignees
- 593
- Inventors
- 4,278
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 3 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 4 | 0 |
| 1993 | 6 | 0 |
| 1994 | 5 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 3 | 0 |
| 1998 | 15 | 0 |
| 1999 | 21 | 0 |
| 2000 | 22 | 0 |
| 2001 | 30 | 21 |
| 2002 | 45 | 53 |
| 2003 | 36 | 47 |
| 2004 | 50 | 65 |
| 2005 | 45 | 63 |
| 2006 | 33 | 63 |
| 2007 | 31 | 78 |
| 2008 | 35 | 64 |
| 2009 | 42 | 70 |
| 2010 | 56 | 63 |
| 2011 | 49 | 87 |
| 2012 | 49 | 83 |
| 2013 | 62 | 96 |
| 2014 | 69 | 112 |
| 2015 | 92 | 136 |
| 2016 | 100 | 123 |
| 2017 | 111 | 143 |
| 2018 | 105 | 151 |
| 2019 | 143 | 214 |
| 2020 | 177 | 195 |
| 2021 | 158 | 171 |
| 2022 | 136 | 203 |
| 2023 | 146 | 203 |
| 2024 | 129 | 191 |
| 2025 | 167 | 167 |
| 2026 | 113 | 141 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Frame cassette with internal cover cases6 Oct 2026US 12,757,677 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor manufacturing device, wafer mounting device, dicing device, and semiconductor manufacturing method6 Oct 2026US 12,757,685 B2Mitsubishi Electric Corporation
- Processing method and processing system22 Sep 2026US 12,745,588 B2Tokyo Electron Limited
- Retaining ring for chemical-mechanical polishing22 Sep 2026US 12,745,596 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Pick-and-place tool with warpage-correction mechanism22 Sep 2026US 12,745,603 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate production method and substrate production apparatus8 Oct 2026US 2026/0314304 A1Ebara Corporation
- Substrate chucking assist module8 Oct 2026US 2026/0314330 A1APPLIED Materials.Inc.
- Device and method for pressing an upper polishing cloth against an upper polishing plate of a machine for simultaneously polishing a front side and a rear side of a semiconductor wafer1 Oct 2026US 2026/0295768 A1Siltronic AG
- Polishing slurry, polishing system, and method for polishing semiconductor substrate1 Oct 2026US 2026/0297384 A1
- Bonding apparatus, bonding system, and bonding method1 Oct 2026US 2026/0305226 A1Tokyo Electron Limited
Most cited
By later US patents
- Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing544US 6,410,459 B1Micron Technology, Inc. · 2002
- Clustertool system software using plasma immersion ion implantation336US 6,321,134 B1Silicon Genesis Corporation · 2001
- Printing semiconductor elements by shear-assisted elastomeric stamp transfer322US 8,506,867 B2Semprius, Inc. · 2013
- Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer303US 5,196,353 AMicron Technology, Inc. · 1993
- Method for sawing wafers employing multiple indexing techniques for multiple die dimensions289US 6,578,458 B1Micron Technology, Inc. · 2003