US 12,745,588 B2 · Processing method and processing system

Abstract

A processing method of processing a combined substrate in which a first substrate and a second substrate are bonded to each other includes acquiring layer information of the combined substrate; forming a non-bonding region in which bonding strength between the first substrate and the second substrate is reduced, by radiating laser light in a pulse shape to a laser absorption film formed at an interface between the first substrate and the second substrate; and separating the first substrate from the second substrate. In the forming of the non-bonding region, a temperature difference between a first temperature in a laser radiation direct region including one light-converging point of the laser light and a second temperature in a laser radiation peripheral region is changed based on at least one of the acquired layer information or a position of the one light-converging point in the combined substrate in a radial direction.

Claims37

Dependent claims

A processing method of processing a combined substrate in which a first substrate and a second substrate are bonded to each other, the processing method comprising:

acquiring layer information of the combined substrate;
forming a non-bonding region in which bonding strength between the first substrate and the second substrate is reduced, by radiating laser light in a pulse shape to a laser absorption film formed at an interface between the first substrate and the second substrate;
and
separating the first substrate from the second substrate,
wherein in the forming of the non-bonding region, a temperature difference between a first temperature in a laser radiation direct region including one light-converging point of the laser light radiated in the pulse shape and a second temperature in a laser radiation peripheral region formed between the one light-converging point and another light-converging point to which the laser light is radiated after the one light-converging point is changed based on at least one of the acquired layer information or a position of the one light-converging point in the combined substrate in a radial direction.

2 more elements

A processing system of processing a combined substrate in which a first substrate and a second substrate are bonded to each other,

wherein a laser absorption film is formed at an interface between the first substrate and the second substrate,
wherein the processing system comprises:
an interface modifying apparatus configured to radiate laser light in a pulse shape to the laser absorption film to form a non-bonding region in which bonding strength between the first substrate and the second substrate is reduced;
a separating apparatus configured to separate the first substrate from the second substrate;
and
a control device, and
wherein the control device performs, in the interface modifying apparatus, a control of changing a temperature difference between a first temperature in a laser radiation direct region including one light-converging point of the laser light radiated in the pulse shape and a second temperature in a laser radiation peripheral region formed between the one light-converging point and another light-converging point to which the laser light is radiated after the one light-converging point based on at least one of layer information acquired prior to the formation of the non-bonding region, or a position of the one light-converging point in the combined substrate in a radial direction.

4 more elements

Dependencies are inferred from the claim text.

Processing method and processing system

Life of this patent

Processing method and processing system

Life of this patent

Abstract

Claims37