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US 2026/0314304 A1Published application
Substrate production method and substrate production apparatus
AssigneeEbara Corporation
InventorMasayuki SATAKE
Life of this patent
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Abstract
The application relates to a substrate manufacturing method and a substrate manufacturing apparatus. The substrate manufacturing method includes a step of applying a filler to a gap between a bevel portion of a first substrate and a bevel portion of a second substrate, and a step of removing air bubbles from the filler applied to the gap.
Claims12
A substrate manufacturing method for manufacturing a laminated substrate formed by bonding a first substrate and a second substrate, comprising:
- a step of applying a filler to a gap between a bevel portion of the first substrate and a bevel portion of the second substrate;
- and
- a step of removing air bubbles from the filler applied to the gap.
A substrate manufacturing apparatus for manufacturing a laminated substrate formed by bonding a first substrate and a second substrate, comprising:
- a coating device configured to apply a filler to a gap between a bevel portion of the first substrate and a bevel portion of the second substrate;
- and
- an air bubble removal device configured to remove air bubbles from the filler applied to the gap.
Dependencies are inferred from the claim text.