Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
AssigneeMicron Technology, Inc.
InventorsSalman Akram, Derek J. Gochnour, Michael E. Hess, David R. Hembree
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Abstract
A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.
Claims24
A method for sawing a semiconductor substrate with a two-blade saw, comprising:
- forming first and second substantially parallel, linear cuts substantially concurrently, substantially across, and substantially through at least a first portion of the semiconductor substrate using the two blades of the two-blade saw;
- and
- forming a third linear cut substantially through said semiconductor substrate substantially parallel to at least one of said first and second linear cuts at a different time than said forming said first and second linear cuts and across at least a second portion of the semiconductor substrate using one blade of the two-blade saw, the other blade of the two-blade saw not contacting the semiconductor substrate during said forming said third linear cut.
A method for sawing a semiconductor substrate with a two-blade saw, comprising:
- forming first and second substantially parallel, linear cuts substantially concurrently at a first portion of a substrate using the two blades of the two-blade saw;
- and
- forming a third linear cut substantially parallel to said first and second linear cuts at a second portion of said substrate using one blade of the two-blade saw, the other blade of the two-blade saw not contacting said substrate during said forming said third linear cut.
Dependencies are inferred from the claim text.