H10P 50/246
Of group iii-v materials
Official title: {of Group III-V materials}
H10P50/246 (Of group iii-v materials) appears on 458 US grants and 420 published applications in this corpus.
Search patents in H10P- Granted patents
- 458
- Published applications
- 420
- Assignees
- 234
- Inventors
- 1,048
- Latest grant
- 26 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 11 | 0 |
| 1988 | 5 | 0 |
| 1989 | 7 | 0 |
| 1990 | 7 | 0 |
| 1991 | 10 | 0 |
| 1992 | 10 | 0 |
| 1993 | 6 | 0 |
| 1994 | 15 | 0 |
| 1995 | 10 | 0 |
| 1996 | 5 | 0 |
| 1997 | 5 | 0 |
| 1998 | 5 | 0 |
| 1999 | 5 | 0 |
| 2000 | 6 | 0 |
| 2001 | 5 | 2 |
| 2002 | 3 | 1 |
| 2003 | 2 | 4 |
| 2004 | 1 | 4 |
| 2005 | 3 | 8 |
| 2006 | 5 | 6 |
| 2007 | 4 | 4 |
| 2008 | 3 | 5 |
| 2009 | 1 | 3 |
| 2010 | 5 | 6 |
| 2011 | 3 | 2 |
| 2012 | 4 | 13 |
| 2013 | 10 | 12 |
| 2014 | 10 | 17 |
| 2015 | 15 | 30 |
| 2016 | 22 | 32 |
| 2017 | 28 | 33 |
| 2018 | 30 | 37 |
| 2019 | 42 | 40 |
| 2020 | 25 | 36 |
| 2021 | 32 | 28 |
| 2022 | 16 | 33 |
| 2023 | 24 | 22 |
| 2024 | 19 | 18 |
| 2025 | 24 | 16 |
| 2026 | 7 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Plasma etching26 May 2026US 12,642,022 B2SPTS Technologies Limited
- Semiconductor structure and method for manufacturing semiconductor structure21 Apr 2026US 12,610,755 B2Enkris Semiconductor, Inc.
- Apparatus and methods for selectively etching silicon oxide films7 Apr 2026US 12,598,928 B2ASM IP Holding B. V.
- Selective gas phase etch of silicon germanium alloys31 Mar 2026US 12,593,634 B2Tokyo Electron Limited
- Microwave providing apparatus, system including the same, and method of manufacturing semiconductor device17 Feb 2026US 12,556,152 B2Semes Co., Ltd.
- Gan trench mosfet and fabrication method1 Oct 2026US 2026/0304832 A1SixPoint Materials, Inc.
- Method for manufacturing semiconductor device1 Oct 2026US 2026/0305267 A1Mitsubishi Electric Corporation
- Resist underlayer film-forming composition containing polycyclic aromatic-containing polymer3 Sep 2026US 2026/0259502 A1Nissan Chemical Corporation
- Atomic layer etching of iii-v materials25 Jun 2026US 2026/0182278 A1Commissariat à I' énergie atomique et aux énergies alternatives
- Selective gas etching for self-aligned pattern transfer23 Apr 2026US 2026/0114248 A1Adeia Semiconductor Solutions LLC
Most cited
By later US patents
- Process for surface treatment519US 4,857,137 AHitachi, Ltd. · 1989
- Dry etching method233US 4,992,136 AHitachi, Ltd. · 1991
- Method of etching a workpiece99US 8,815,720 B2Varian Semiconductor Equipment Associates, Inc. · 2014
- Method of semiconductor device manufacture89US 5,188,705 AFEI Company · 1993
- Removal of surface passivation77US 9,490,145 B2ASM IP Holding B. V. · 2016