H10P 14/69393
The material containing tantalum
Official title: {the material containing tantalum, e.g. Ta2O5}
H10P14/69393 (The material containing tantalum) appears on 756 US grants and 693 published applications in this corpus.
Search patents in H10P- Granted patents
- 756
- Published applications
- 693
- Assignees
- 221
- Inventors
- 1,403
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 5 | 0 |
| 1994 | 3 | 0 |
| 1995 | 5 | 0 |
| 1996 | 2 | 0 |
| 1997 | 7 | 0 |
| 1998 | 5 | 0 |
| 1999 | 13 | 0 |
| 2000 | 26 | 0 |
| 2001 | 44 | 37 |
| 2002 | 60 | 74 |
| 2003 | 70 | 81 |
| 2004 | 57 | 58 |
| 2005 | 43 | 50 |
| 2006 | 37 | 46 |
| 2007 | 39 | 33 |
| 2008 | 26 | 26 |
| 2009 | 19 | 20 |
| 2010 | 23 | 17 |
| 2011 | 15 | 9 |
| 2012 | 13 | 11 |
| 2013 | 15 | 17 |
| 2014 | 13 | 14 |
| 2015 | 18 | 16 |
| 2016 | 15 | 14 |
| 2017 | 19 | 23 |
| 2018 | 22 | 28 |
| 2019 | 24 | 21 |
| 2020 | 23 | 21 |
| 2021 | 21 | 19 |
| 2022 | 10 | 12 |
| 2023 | 11 | 18 |
| 2024 | 11 | 13 |
| 2025 | 14 | 10 |
| 2026 | 7 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for forming region-selective thin film using selectivating agent8 Sep 2026US 12,729,427 B2EGTM Co., Ltd.
- Methods for patterning substrates to adjust voltage properties26 May 2026US 12,642,021 B2APPLIED Materials.Inc.
- Semiconductor device including work function layer doped with barrier elements and method for forming the same17 Mar 2026US 12,581,876 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Interconnect structure for semiconductor device and related methods3 Mar 2026US 12,568,807 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Sequencing chip and manufacturing method therefor27 Jan 2026US 12,538,721 B2Bgi Shenzhen
- Interconnect structure for semiconductor device and related methods25 Jun 2026US 2026/0182327 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Wafer fixed charge control in physical vapor deposition18 Jun 2026US 2026/0173806 A1APPLIED Materials.Inc.
- Methods for depositing an oxide film on a substrate by a cyclical deposition process and related device structures23 Apr 2026US 2026/0114192 A1ASM IP Holding B. V.
- High bandwidth package structure29 Jan 2026US 2026/0033309 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method for manufacturing metal fluoride-containing organic polymer film, patterning method, and method for manufacturing semiconductor device8 Jan 2026US 2026/0011545 A1Kioxia Corporation
Most cited
By later US patents
- Apparatus for performing growth of compound thin films918US 4,389,973 AOy Lohja AB · 1983
- Method for manufacturing thin film using atomic layer deposition885US 6,270,572 B1Samsung Electronics Co., Ltd. · 2001
- Methods of forming thin films by atomic layer deposition842US 6,468,924 B2Samsung Electronics Co., Ltd. · 2002
- Precursor source mixtures666US 6,984,591 B1International Business Machines Corporation · 2006
- Forming capping layer over metal wire structure using selective atomic layer deposition590US 7,084,060 B1International Business Machines Corporation · 2006