H10P 14/3602
In-situ cleaning
Official title: {In-situ cleaning}
H10P14/3602 (In-situ cleaning) appears on 404 US grants and 400 published applications in this corpus.
Search patents in H10P- Granted patents
- 404
- Published applications
- 400
- Assignees
- 231
- Inventors
- 1,113
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 2 | 0 |
| 1989 | 6 | 0 |
| 1990 | 4 | 0 |
| 1991 | 3 | 0 |
| 1992 | 4 | 0 |
| 1993 | 4 | 0 |
| 1994 | 1 | 0 |
| 1995 | 6 | 0 |
| 1996 | 8 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 9 | 0 |
| 2000 | 10 | 0 |
| 2001 | 13 | 5 |
| 2002 | 16 | 15 |
| 2003 | 6 | 13 |
| 2004 | 9 | 14 |
| 2005 | 12 | 15 |
| 2006 | 16 | 12 |
| 2007 | 3 | 15 |
| 2008 | 6 | 14 |
| 2009 | 9 | 12 |
| 2010 | 12 | 17 |
| 2011 | 12 | 10 |
| 2012 | 12 | 13 |
| 2013 | 11 | 20 |
| 2014 | 13 | 20 |
| 2015 | 16 | 19 |
| 2016 | 24 | 19 |
| 2017 | 17 | 20 |
| 2018 | 17 | 18 |
| 2019 | 12 | 25 |
| 2020 | 26 | 24 |
| 2021 | 16 | 15 |
| 2022 | 14 | 23 |
| 2023 | 9 | 12 |
| 2024 | 13 | 17 |
| 2025 | 10 | 8 |
| 2026 | 5 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Substrate processing method and substrate processing apparatus6 Oct 2026US 12,757,648 B2Tokyo Electron Limited
- Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatus28 Jul 2026US 12,692,623 B2Kokusai Electric Corporation
- Uniform epitaxial growth over crystalline template19 May 2026US 12,635,197 B2APPLIED Materials.Inc.
- Method for manufacturing semiconductor silicon wafer composed of silicon wafer substrate and silicon monocrystalline epitaxial layer5 May 2026US 12,622,185 B2Globalwafers Japan Co., Ltd.
- Methods of forming silicon germanium structures3 Feb 2026US 12,543,516 B2ASM IP Holding B. V.
- Film forming method and film forming apparatus10 Sep 2026US 2026/0265949 A1Tokyo Electron Limited
- Method and assembly for the removal of silicon carbide from reactor parts27 Aug 2026US 2026/0250840 A1Lpe S.P.A.
- Method for manufacturing semiconductor device14 May 2026US 2026/0136847 A1Hamamatsu Photonics K.K.
- Controlling auto-doping in epitaxially grown silicon-containing materials16 Apr 2026US 2026/0107704 A1APPLIED Materials.Inc.
- Semiconductor Device and Method5 Mar 2026US 2026/0068303 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Fabrication method for a thin film semiconductor device, the thin film semiconductor device itself, liquid crystal display, and electronic device605US 6,017,779 ASeiko Epson Corporation · 2000
- Method for forming silicon-containing materials during a photoexcitation deposition process535US 7,651,955 B2APPLIED Materials.Inc. · 2010
- Sulfur-containing thin films479US 9,245,742 B2ASM IP Holding B. V. · 2016
- Plasma pre-clean module and process477US 9,299,557 B2ASM IP Holding B. V. · 2016
- Plasma pre-clean module and process474US 9,514,927 B2ASM IP Holding B. V. · 2016