H10P 14/3238
Being insulating materials
Official title: {being insulating materials}
H10P14/3238 (Being insulating materials) appears on 2,715 US grants and 2,725 published applications in this corpus.
Search patents in H10P- Granted patents
- 2,715
- Published applications
- 2,725
- Assignees
- 658
- Inventors
- 4,151
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 3 | 0 |
| 1983 | 2 | 0 |
| 1984 | 7 | 0 |
| 1985 | 11 | 0 |
| 1986 | 8 | 0 |
| 1987 | 17 | 0 |
| 1988 | 10 | 0 |
| 1989 | 18 | 0 |
| 1990 | 6 | 0 |
| 1991 | 14 | 0 |
| 1992 | 13 | 0 |
| 1993 | 15 | 0 |
| 1994 | 22 | 0 |
| 1995 | 26 | 0 |
| 1996 | 35 | 0 |
| 1997 | 33 | 0 |
| 1998 | 50 | 0 |
| 1999 | 53 | 0 |
| 2000 | 66 | 0 |
| 2001 | 81 | 37 |
| 2002 | 89 | 131 |
| 2003 | 92 | 229 |
| 2004 | 99 | 141 |
| 2005 | 94 | 145 |
| 2006 | 121 | 151 |
| 2007 | 105 | 144 |
| 2008 | 98 | 85 |
| 2009 | 103 | 40 |
| 2010 | 100 | 74 |
| 2011 | 77 | 73 |
| 2012 | 50 | 91 |
| 2013 | 64 | 78 |
| 2014 | 107 | 93 |
| 2015 | 98 | 109 |
| 2016 | 99 | 108 |
| 2017 | 95 | 117 |
| 2018 | 91 | 112 |
| 2019 | 101 | 114 |
| 2020 | 105 | 103 |
| 2021 | 82 | 119 |
| 2022 | 82 | 110 |
| 2023 | 81 | 113 |
| 2024 | 83 | 87 |
| 2025 | 59 | 77 |
| 2026 | 43 | 44 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Method of increasing sensitivity and limits of detection and controlling fluid flow over sensor and sensor array6 Oct 2026US 12,757,650 B2The United States of America as represented by the Secretary of the Air Force
- Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium15 Sep 2026US 12,740,347 B2Kokusai Electric Corporation
- Patterned aluminum nitride composite substrate and preparation method thereof25 Aug 2026US 12,716,146 B2Peking University
- Semiconductor film25 Aug 2026US 12,720,828 B2NGK Insulators, Ltd.
- Devices and methods involving low-temperature-grown diamond in electronic devices27 Aug 2026US 2026/0250881 A1The Board of Trustees of the Leland Stanford Junior University
- Semiconductor structure and method27 Aug 2026US 2026/0255893 A1Turun Yliopisto
- Systems and methods for tuning porous bandgaps to reduce thermal donor effects20 Aug 2026US 2026/0247673 A1IQE plc
- Film forming method and film forming apparatus13 Aug 2026US 2026/0239897 A1Tokyo Electron Limited
- Manufacturing Method Of Semiconductor Device13 Aug 2026US 2026/0239937 A1Semiconductor Energy Laboratory Co.Ltd.
Most cited
By later US patents
- Method for forming a film and method for manufacturing a thin film transistor649US 5,480,818 AFujitsu Limited · 1996
- Method of manufacturing a substrate using an SiGe layer600US 6,607,948 B1Kabushiki Kaisha Toshiba · 2003
- Layer member forming method532US 6,984,595 B1Semiconductor Energy Laboratory Co.Ltd. · 2006
- Method and apparatus for time-division plasma chopping in a multi-channel plasma processing equipment490US 5,273,609 ATexas Instruments Incorporated · 1993
- Method of forming polycrystalline silicon layer and atomic layer deposition apparatus used for the same469US 8,048,783 B2Samsung Mobile Display Co., Ltd. · 2011