H10D 89/00
Aspects of integrated devices not covered by groups h10d84/00 - h10d88/00
Official title: Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
H10D89/00 (Aspects of integrated devices not covered by groups h10d84/00 - h10d88/00) appears on 18,253 US grants and 18,387 published applications in this corpus.
Search patents in H10D- Granted patents
- 18,253
- Published applications
- 18,387
- Assignees
- 1,900
- Inventors
- 20,938
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 15 | 0 |
| 1977 | 28 | 0 |
| 1978 | 20 | 0 |
| 1979 | 18 | 0 |
| 1980 | 15 | 0 |
| 1981 | 26 | 0 |
| 1982 | 13 | 0 |
| 1983 | 20 | 0 |
| 1984 | 28 | 0 |
| 1985 | 24 | 0 |
| 1986 | 25 | 0 |
| 1987 | 40 | 0 |
| 1988 | 39 | 0 |
| 1989 | 66 | 0 |
| 1990 | 65 | 0 |
| 1991 | 83 | 0 |
| 1992 | 83 | 0 |
| 1993 | 108 | 0 |
| 1994 | 123 | 0 |
| 1995 | 148 | 0 |
| 1996 | 189 | 0 |
| 1997 | 199 | 0 |
| 1998 | 278 | 0 |
| 1999 | 304 | 0 |
| 2000 | 241 | 0 |
| 2001 | 256 | 101 |
| 2002 | 339 | 342 |
| 2003 | 356 | 342 |
| 2004 | 338 | 448 |
| 2005 | 349 | 553 |
| 2006 | 392 | 587 |
| 2007 | 395 | 596 |
| 2008 | 400 | 676 |
| 2009 | 426 | 656 |
| 2010 | 604 | 732 |
| 2011 | 625 | 600 |
| 2012 | 644 | 684 |
| 2013 | 694 | 721 |
| 2014 | 823 | 791 |
| 2015 | 784 | 868 |
| 2016 | 889 | 907 |
| 2017 | 946 | 941 |
| 2018 | 917 | 877 |
| 2019 | 975 | 922 |
| 2020 | 917 | 943 |
| 2021 | 762 | 816 |
| 2022 | 679 | 889 |
| 2023 | 698 | 931 |
| 2024 | 738 | 916 |
| 2025 | 727 | 878 |
| 2026 | 382 | 670 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Electrostatic discharge circuit, display substrate, and display device6 Oct 2026US 12,756,181 B2Boe Technology Group Co., Ltd.
- Semiconductor device6 Oct 2026US 12,756,183 B2Socionext Inc.
- Half-bridge circuit using monolithic flip-chip GAN power devices6 Oct 2026US 12,756,203 B2Navitas Semiconductor Limited
- Vertical transistors with backside power delivery6 Oct 2026US 12,757,371 B2Apple Inc.
- Diode structure for direct backside contact, backside power delivery network6 Oct 2026US 12,757,457 B2QUALCOMM Incorporated
- Semiconductor switch with degradation detection8 Oct 2026US 2026/0309774 A1Infineon Technologies AG
- Electrostatic discharge protection8 Oct 2026US 2026/0312402 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit and method of forming the same8 Oct 2026US 2026/0312573 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit with esd protection circuit8 Oct 2026US 2026/0312588 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Varying the po space in semiconductor layouts8 Oct 2026US 2026/0313864 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Contact plugs in SRAM cells and the method of forming the same1,465US 9,236,300 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- System and methods for converting planar design to FinFET design1,326US 8,816,444 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Three dimensional memory in a system on a chip499US 8,042,082 B22011
- Multi-chip semiconductor arrangements using flip chip dies446US 5,399,898 ALSI Logic Corporation · 1995
- Semiconductor signal processing device422US 8,274,841 B2Renesas Electronics Corporation · 2012