H10D 86/80
Integrated devices formed in or on insulating or conducting substrates: characterised by
Official title: characterised by multiple passive components, e.g. resistors, capacitors or inductors
H10D86/80 (Integrated devices formed in or on insulating or conducting substrates: characterised by) appears on 1,366 US grants and 1,417 published applications in this corpus.
Search patents in H10D- Granted patents
- 1,366
- Published applications
- 1,417
- Assignees
- 397
- Inventors
- 2,313
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 3 | 0 |
| 1978 | 3 | 0 |
| 1979 | 1 | 0 |
| 1980 | 9 | 0 |
| 1981 | 6 | 0 |
| 1982 | 11 | 0 |
| 1983 | 14 | 0 |
| 1984 | 11 | 0 |
| 1985 | 3 | 0 |
| 1986 | 12 | 0 |
| 1987 | 5 | 0 |
| 1988 | 4 | 0 |
| 1989 | 10 | 0 |
| 1990 | 7 | 0 |
| 1991 | 7 | 0 |
| 1992 | 5 | 0 |
| 1993 | 8 | 0 |
| 1994 | 7 | 0 |
| 1995 | 2 | 0 |
| 1996 | 5 | 0 |
| 1997 | 7 | 0 |
| 1998 | 10 | 0 |
| 1999 | 5 | 0 |
| 2000 | 5 | 0 |
| 2001 | 5 | 3 |
| 2002 | 11 | 10 |
| 2003 | 6 | 19 |
| 2004 | 15 | 33 |
| 2005 | 25 | 45 |
| 2006 | 23 | 75 |
| 2007 | 31 | 94 |
| 2008 | 36 | 69 |
| 2009 | 45 | 62 |
| 2010 | 84 | 56 |
| 2011 | 80 | 84 |
| 2012 | 67 | 49 |
| 2013 | 83 | 62 |
| 2014 | 72 | 57 |
| 2015 | 44 | 46 |
| 2016 | 59 | 41 |
| 2017 | 49 | 57 |
| 2018 | 54 | 62 |
| 2019 | 59 | 59 |
| 2020 | 57 | 79 |
| 2021 | 60 | 62 |
| 2022 | 46 | 80 |
| 2023 | 51 | 72 |
| 2024 | 49 | 69 |
| 2025 | 54 | 42 |
| 2026 | 38 | 30 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Isolator29 Sep 2026US 12,751,336 B2Kabushiki Kaisha Toshiba
- Signal transmission device and insulated module29 Sep 2026US 12,751,339 B2Rohm Co., Ltd.
- Interposer including inductor devices15 Sep 2026US 12,740,153 B2QUALCOMM Incorporated
- Packages with chips comprising inductor-vias and methods forming the same25 Aug 2026US 12,720,775 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor structure and method for forming same11 Aug 2026US 12,707,708 B2Semiconductor Manufacturing International (Shanghai) Corporation
- Monolithic microwave integrated circuit1 Oct 2026US 2026/0304907 A1Qorvo US, Inc.
- Shielded deep trench capacitor structure and methods of forming the same1 Oct 2026US 2026/0304958 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Lateral coils used for energy transfer over isolation region in multivoltage devices1 Oct 2026US 2026/0305328 A1Infineon Technologies AG
- Package comprising a chiplet located between an integrated device and a metallization portion24 Sep 2026US 2026/0293772 A1QUALCOMM Incorporated
- Semiconductor device10 Sep 2026US 2026/0268967 A1Semiconductor Energy Laboratory Co.Ltd.
Most cited
By later US patents
- Packages with passive devices and methods of forming the same592US 8,680,647 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Method for manufacturing semiconductor device391US 8,324,699 B2Semiconductor Energy Laboratory Co.Ltd. · 2012
- ID label, ID card, and ID tag233US 8,136,735 B2Semiconductor Energy Laboratory Co.Ltd. · 2012
- A multi-frequency resonant tag circuit for use with an electronic security system having improved noise discrimination203US 3,967,161 A1976
- Display device201US 7,687,808 B2Semiconductor Energy Laboratory Co.Ltd. · 2010