Interposer including inductor devices

A method of manufacturing an interposer, comprising:

• forming a first metallization layer on a substrate, the first metallization layer having a first plurality of conductive patterns;
• forming a second metallization layer having a second plurality of conductive patterns;
• and
• forming a via layer disposed between the first metallization layer and the second metallization layer, the via layer having a plurality of vias,
• wherein:
• at least a portion of the first plurality of conductive patterns, a portion of the second plurality of conductive patterns, or both are configured to form a first inductor device and a second inductor device,
• the first inductor device is electrically coupled between a first power node and a second power node of the interposer, and
• the second inductor device is electrically coupled between the first power node and a third power node of the interposer.

An integrated circuit (IC) package, comprising:

• an interposer comprising:
• a substrate;
• a first metallization layer on the substrate, the first metallization layer having a first plurality of conductive patterns;
• a second metallization layer having a second plurality of conductive patterns;
• and
• a via layer disposed between the first metallization layer and the second metallization layer, the via layer having a plurality of vias,
• a first IC die mounted on the interposer, the first IC die including a first circuit block and a second circuit block,
• wherein
• at least a portion of the first plurality of conductive patterns, a portion of the second plurality of conductive patterns, or both are configured to form a first inductor device and a second inductor device,
• the first inductor device is electrically coupled between a first power node and a second power node of the interposer,
• the second inductor device is electrically coupled between the first power node and a third power node of the interposer,
• the first circuit block includes a first power terminal electrically coupled to the second power node of the interposer, and
• the second circuit block includes a second power node electrically coupled to the third power node of the interposer.