H10D 86/85
Characterised by only passive components
Official title: characterised by only passive components
H10D86/85 (Characterised by only passive components) appears on 791 US grants and 793 published applications in this corpus.
Search patents in H10D- Granted patents
- 791
- Published applications
- 793
- Assignees
- 290
- Inventors
- 1,549
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 3 | 0 |
| 1978 | 3 | 0 |
| 1979 | 1 | 0 |
| 1980 | 9 | 0 |
| 1981 | 6 | 0 |
| 1982 | 10 | 0 |
| 1983 | 14 | 0 |
| 1984 | 9 | 0 |
| 1985 | 2 | 0 |
| 1986 | 7 | 0 |
| 1987 | 3 | 0 |
| 1988 | 4 | 0 |
| 1989 | 9 | 0 |
| 1990 | 5 | 0 |
| 1991 | 7 | 0 |
| 1992 | 2 | 0 |
| 1993 | 8 | 0 |
| 1994 | 5 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 4 | 0 |
| 1998 | 7 | 0 |
| 1999 | 4 | 0 |
| 2000 | 4 | 0 |
| 2001 | 1 | 2 |
| 2002 | 9 | 7 |
| 2003 | 4 | 13 |
| 2004 | 12 | 21 |
| 2005 | 15 | 30 |
| 2006 | 17 | 43 |
| 2007 | 24 | 39 |
| 2008 | 21 | 24 |
| 2009 | 23 | 24 |
| 2010 | 28 | 27 |
| 2011 | 27 | 23 |
| 2012 | 23 | 27 |
| 2013 | 31 | 31 |
| 2014 | 34 | 38 |
| 2015 | 19 | 27 |
| 2016 | 35 | 23 |
| 2017 | 20 | 23 |
| 2018 | 28 | 38 |
| 2019 | 46 | 43 |
| 2020 | 37 | 49 |
| 2021 | 40 | 43 |
| 2022 | 27 | 44 |
| 2023 | 33 | 54 |
| 2024 | 35 | 58 |
| 2025 | 38 | 29 |
| 2026 | 30 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Isolator29 Sep 2026US 12,751,336 B2Kabushiki Kaisha Toshiba
- Signal transmission device and insulated module29 Sep 2026US 12,751,339 B2Rohm Co., Ltd.
- Interposer including inductor devices15 Sep 2026US 12,740,153 B2QUALCOMM Incorporated
- Packages with chips comprising inductor-vias and methods forming the same25 Aug 2026US 12,720,775 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Transformer device and semiconductor device28 Jul 2026US 12,696,547 B2Mitsubishi Electric Corporation
- Shielded deep trench capacitor structure and methods of forming the same1 Oct 2026US 2026/0304958 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Package comprising a chiplet located between an integrated device and a metallization portion24 Sep 2026US 2026/0293772 A1QUALCOMM Incorporated
- Filter, manufacturing method thereof and electronic apparatus30 Jul 2026US 2026/0221952 A1Beijing Boe Optoelectronics Technology Co., Ltd.
- Insulation module and gate driver2 Jul 2026US 2026/0191086 A1Rohm Co., Ltd.
- Semiconductor bridge with static discharge protection and the method of the same4 Jun 2026US 2026/0153312 A1Hangzhou Dianzi University
Most cited
By later US patents
- Packages with passive devices and methods of forming the same592US 8,680,647 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- A multi-frequency resonant tag circuit for use with an electronic security system having improved noise discrimination203US 3,967,161 A1976
- RF reactivatable marker for electronic article surveillance system126US 4,745,401 AMinnesota Mining and Manufacturing Company · 1988
- Process for fabricating resonant tag circuit constructions122US 4,369,557 A1983
- Multi-layer chip capacitor120US 6,724,611 B1Intel Corporation · 2004