Filter, manufacturing method thereof and electronic apparatus

A method for manufacturing an encapsulation structure, comprising:

• providing a dielectric substrate such that the dielectric substrate comprises at least one first connection via penetrating through the dielectric substrate in a thickness direction of the dielectric substrate, and comprises a first surface and a second surface opposite to each other in the thickness direction of the dielectric substrate;
• forming at least one first connection electrode in the at least one first connection via, respectively;
• forming a buffer layer on the first surface and at least one second connection via penetrating through the buffer layer such that the buffer layer at least comprises one resin material layer;
• forming a first wiring layer on a side of the buffer layer away from the dielectric substrate such that the first wiring layer is electrically connected to the at least one first connection electrode through the at least one second connection via;
• and
• forming a second wiring layer on the second surface such that the second wiring layer is electrically connected to the first wiring layer through the at least one first connection electrode.