H10D 84/979
Data lines
Official title: {Data lines, e.g. buses}
H10D84/979 (Data lines) appears on 22 US grants and 29 published applications in this corpus.
Search patents in H10D- Granted patents
- 22
- Published applications
- 29
- Assignees
- 11
- Inventors
- 54
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2012 | 0 | 1 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 1 |
| 2016 | 1 | 1 |
| 2017 | 2 | 3 |
| 2018 | 2 | 3 |
| 2019 | 4 | 3 |
| 2020 | 3 | 3 |
| 2021 | 1 | 2 |
| 2022 | 0 | 2 |
| 2023 | 2 | 2 |
| 2024 | 5 | 4 |
| 2025 | 1 | 2 |
| 2026 | 1 | 2 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Integrated circuit structure with front side signal lines and backside power delivery4 Aug 2026US 12,701,782 B2Intel Corporation
- Power rail and signal conducting line arrangement27 May 2025US 12,317,589 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit structure with front side signal lines and backside power delivery30 Jul 2024US 12,051,692 B2Intel Corporation
- Integrated circuit device and method18 Jun 2024US 12,014,982 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Power rail and signal conducting line arrangement23 Apr 2024US 11,967,596 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Device Disaggregation For Improved Performance27 Aug 2026US 2026/0255673 A1Adeia Semiconductor Inc.
- Semiconductor device and method of manufacturing the same14 May 2026US 2026/0136661 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Multi-layer conductive vias with etch-selective liners18 Dec 2025US 2025/0386478 A1Intel Corporation
- Power rail and signal conducting line arrangement4 Sep 2025US 2025/0280600 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit structure with front side signal lines and backside power delivery24 Oct 2024US 2024/0355819 A1Intel Corporation
Most cited
By later US patents
- Cell of transmission gate free circuit and integrated circuit and integrated circuit layout including the same14US 10,270,430 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2019
- Device disaggregation for improved performance12US 11,916,076 B2Adeia Semiconductor Inc. · 2024
- Connection structure for vertical gate all around (VGAA) devices on semiconductor on insulator (SOI) substrate10US 9,653,563 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Enhancing integrated circuit density with active atomic reservoir8US 9,929,087 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2018
- Integrated circuit structure with front side signal lines and backside power delivery6US 12,051,692 B2Intel Corporation · 2024