H10D 80/30
The at least one device being covered by groups h10d84/00 - h10d86/00
Official title: the at least one device being covered by groups H10D84/00 - H10D86/00, e.g. assemblies comprising integrated circuit processor chips
H10D80/30 (The at least one device being covered by groups h10d84/00 - h10d86/00) appears on 10 US grants and 642 published applications in this corpus.
Search patents in H10D- Granted patents
- 10
- Published applications
- 642
- Assignees
- 111
- Inventors
- 1,307
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2022 | 0 | 1 |
| 2023 | 0 | 1 |
| 2024 | 0 | 1 |
| 2025 | 5 | 104 |
| 2026 | 5 | 535 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Display apparatus25 Aug 2026US 12,720,974 B2Samsung Display Co., Ltd.
- Packaging optical components in a circuit package9 Jun 2026US 12,650,563 B2Celestial Al Inc.
- Two-sided liquid cooling5 May 2026US 12,622,272 B1Adeia Semiconductor Bonding Technologies Inc.
- Converting processing dimensions of a wafer package10 Mar 2026US 12,571,971 B2Celestial AI Inc.
- Preserving access to edge coupling components on a wafer package3 Mar 2026US 12,566,305 B2Celestial AI Inc.
- Semiconductor device and method of manufacturing semiconductor device8 Oct 2026US 2026/0311730 A1SK hynix Inc.
- Semiconductor device including capacitors, word line pads and word line contacts8 Oct 2026US 2026/0313882 A1Samsung Electronics Co., Ltd.
- Three-dimensional memory device containing peripheral circuit with fin field effect transistors and method of making the same8 Oct 2026US 2026/0313892 A1SanDisk Technologies LLC
- Semiconductor device with aligned channel structures and gate contact structures8 Oct 2026US 2026/0313896 A1Samsung Electronics Co., Ltd.
- Microelectronic devices, and related methods and memory devices8 Oct 2026US 2026/0313897 A1Micron Technology, Inc.
Most cited
By later US patents
No patent in this class has been cited by a later US patent yet.