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US 12,566,305 B2Granted
Preserving access to edge coupling components on a wafer package
AssigneeCelestial AI Inc.
InventorsAnkur Aggarwal, Anmol Rathi, Suresh Venkata Pothukuchi
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Abstract
The present disclosure relates to packaging techniques in connection with packaging electrical and optical components within circuit packages. For example, one or more examples described herein involve techniques for packaging an electro-photonic circuit while preserving access to a grating coupler, which may involve using a sacrificial die and/or a sacrificial cap in conjunction with a unique overmolding process. Additional examples involve techniques for preserving access to an edge coupling structure.
Claims23
A circuit package, comprising:
- a photonic layer having an optical region near a side surface of the photonic layer and configured to allow one or more fibers to be coupled to waveguides that are formed within the photonic layer, the optical region including edge coupling structures formed within the optical region and being accessible by way of an optical window that provides physical access to the side surface of the photonic layer, the photonic layer further including a first portion of an electro-photonic transceiver optically coupled to the optical region and configured to send and receive light through the optical region in a direction substantially parallel to a top surface of the photonic layer, wherein the edge coupling structures are v-grooves formed within the side surface of the photonic layer;
- one or more electronic components having a first plurality of electrical connections on a bottom surface thereof, and being positioned on the top surface of the photonic layer of the package such that there are electrical couplings between the first plurality of electrical connections and a second plurality of electrical connections on the top surface of the photonic layer, the one or more electronic components having a second portion of the electro-photonic transceiver connected to the first portion of the electro-photonic transceiver via the electrical couplings;
- and
- an overmold layer, comprising:
- overmold deposited over the photonic layer and the one or more electronic components;
- and
- a sidewall structure adjacent to the overmold on the top surface of the photonic layer positioned above the optical region and not extending over the side surface of the photonic layer.
4 more elements
A circuit package, comprising:
- a photonic layer having an optical region near a side surface of the photonic layer and configured to allow one or more fibers to be coupled to waveguides that are formed within the photonic layer, the optical region including edge coupling structures formed within the optical region and being accessible by way of an optical window that provides physical access to the side surface of the photonic layer, the photonic layer further including a first portion of an electro-photonic transceiver optically coupled to the optical region and configured to send and receive light through the optical region in a direction substantially parallel to a top surface of the photonic layer;
- one or more electronic components having a first plurality of electrical connections on a bottom surface thereof, and being positioned on the top surface of the photonic layer of the package such that there are electrical couplings between the first plurality of electrical connections and a second plurality of electrical connections on the top surface of the photonic layer, the one or more electronic components having a second portion of the electro-photonic transceiver connected to the first portion of the electro-photonic transceiver via the electrical couplings, wherein the electro-photonic transceiver comprises:
- a driver connected to a modulator in the first portion,
- a transimpedance amplifier (TIA) connected to a photodiode in the first portion,
- a serializer in the second portion that provides an output to the driver, and
- a deserializer in the second portion that receives an input from the TIA;
- and
- an overmold layer, comprising:
- overmold deposited over the photonic layer and the one or more electronic components, and
- a sidewall structure adjacent to the overmold on the top surface of the photonic layer positioned above the optical region and not extending over the side surface of the photonic layer.
7 more elements
Dependencies are inferred from the claim text.