H10D 80/00
Assemblies of multiple devices comprising at least one device covered by this
Official title: Assemblies of multiple devices comprising at least one device covered by this subclass
H10D80/00 (Assemblies of multiple devices comprising at least one device covered by this) appears on 18 US grants and 857 published applications in this corpus.
Search patents in H10D- Granted patents
- 18
- Published applications
- 857
- Assignees
- 165
- Inventors
- 1,821
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2022 | 0 | 3 |
| 2023 | 0 | 2 |
| 2024 | 0 | 4 |
| 2025 | 7 | 171 |
| 2026 | 11 | 677 |
By publication year. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor relay and electric circuit comprising same6 Oct 2026US 12,756,394 B2Panasonic Intellectual Property Management Co., Ltd.
- Display apparatus25 Aug 2026US 12,720,974 B2Samsung Display Co., Ltd.
- Display apparatus11 Aug 2026US 12,707,817 B2Samsung Display Co., Ltd.
- Packaging optical components in a circuit package9 Jun 2026US 12,650,563 B2Celestial Al Inc.
- Semiconductor device and electronic device19 May 2026US 12,632,718 B2Semiconductor Energy Laboratory Co.Ltd.
- Semiconductor device and method of manufacturing semiconductor device8 Oct 2026US 2026/0311730 A1SK hynix Inc.
- Semiconductor device including capacitors, word line pads and word line contacts8 Oct 2026US 2026/0313882 A1Samsung Electronics Co., Ltd.
- Three-dimensional memory device containing peripheral circuit with fin field effect transistors and method of making the same8 Oct 2026US 2026/0313892 A1SanDisk Technologies LLC
- Semiconductor device with aligned channel structures and gate contact structures8 Oct 2026US 2026/0313896 A1Samsung Electronics Co., Ltd.
- Microelectronic devices, and related methods and memory devices8 Oct 2026US 2026/0313897 A1Micron Technology, Inc.
Most cited
By later US patents
No patent in this class has been cited by a later US patent yet.