H10D 80/20
The at least one device being covered by groups h10d1/00 - h10d48/00
Official title: the at least one device being covered by groups H10D1/00 - H10D48/00, e.g. assemblies comprising capacitors, power FETs or Schottky diodes
H10D80/20 (The at least one device being covered by groups h10d1/00 - h10d48/00) appears on 8 US grants and 327 published applications in this corpus.
Search patents in H10D- Granted patents
- 8
- Published applications
- 327
- Assignees
- 96
- Inventors
- 594
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2022 | 0 | 2 |
| 2023 | 0 | 1 |
| 2024 | 0 | 3 |
| 2025 | 2 | 72 |
| 2026 | 6 | 249 |
By publication year. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor relay and electric circuit comprising same6 Oct 2026US 12,756,394 B2Panasonic Intellectual Property Management Co., Ltd.
- Display apparatus11 Aug 2026US 12,707,817 B2Samsung Display Co., Ltd.
- Semiconductor device and electronic device19 May 2026US 12,632,718 B2Semiconductor Energy Laboratory Co.Ltd.
- Chip packaging structure and preparation method therefor14 Apr 2026US 12,604,730 B2National Center for Advanced Packaging Co., Ltd.
- Multi-chip semiconductor switching device24 Mar 2026US 12,588,552 B2Fuji Electric Co., Ltd.
- Concentric dtc bumps for high density package decap solution8 Oct 2026US 2026/0313924 A1QUALCOMM Incorporated
- A Multi-Layer Deep-Trench Capacitor8 Oct 2026US 2026/0313925 A1Lotus Microsystems Aps
- Semiconductor device8 Oct 2026US 2026/0314463 A1Kabushiki Kaisha Toshiba
- Power electronics module and inverter including a power electronics module8 Oct 2026US 2026/0314465 A1Schaeffler Technologies AG & Co. KG
- Semiconductor device, semiconductor module, and vehicle8 Oct 2026US 2026/0314507 A1Rohm Co., Ltd.
Most cited
By later US patents
No patent in this class has been cited by a later US patent yet.