Converting processing dimensions of a wafer package

A method of making a wafer structure having a desired base dimension, comprising;

• obtaining a photonic integrated circuit (PIC) wafer having a first base dimension, the desired base dimension being larger than the first base dimension, the PIC wafer comprising:
• an optical region near a top surface of the PIC wafer configured to allow light to enter and exit the PIC wafer;
• optical transmitter and receiver portions in optical communication with the optical region, the optical transmitter and receiver portions having electrical interconnects to the top surface of the PIC wafer in a portion that does not extend into the optical region;
• and
• one or more electronic components including electrical transmitter and receiver portions interconnected with the optical transmitter and receiver portions via electrical interconnects, forming electro-optical paths to and from the one or more electronic components to the optical region;
• positioning the PIC wafer on a base plate having a base dimension that is the desired base dimension, wherein the PIC wafer covers only a portion of a top surface of the base plate such that a portion of the top surface of the base plate is exposed around a perimeter of the PIC wafer;
• and
• depositing an overmold over the PIC wafer, the one or more electronic components, and the exposed portion of the base plate around the perimeter of the PIC wafer, thereby forming a wafer structure having the desired base dimension;
• removing a layer of the overmold, thereby exposing the one or more electronic components disposed on the PIC wafer, wherein removing the layer of the overmold exposes an optical path to the optical region near the top surface of the PIC wafer.