H10D 1/474
Comprising refractory metals, transition metals, noble metals, metal compounds or metal alloys
Official title: {comprising refractory metals, transition metals, noble metals, metal compounds or metal alloys, e.g. silicides}
H10D1/474 (Comprising refractory metals, transition metals, noble metals, metal compounds or metal alloys) appears on 655 US grants and 739 published applications in this corpus.
Search patents in H10D- Granted patents
- 655
- Published applications
- 739
- Assignees
- 196
- Inventors
- 1,324
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 3 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 4 | 0 |
| 1996 | 7 | 0 |
| 1997 | 7 | 0 |
| 1998 | 4 | 0 |
| 1999 | 5 | 0 |
| 2000 | 8 | 0 |
| 2001 | 14 | 8 |
| 2002 | 13 | 14 |
| 2003 | 6 | 7 |
| 2004 | 12 | 14 |
| 2005 | 11 | 18 |
| 2006 | 6 | 16 |
| 2007 | 10 | 4 |
| 2008 | 14 | 6 |
| 2009 | 2 | 8 |
| 2010 | 6 | 11 |
| 2011 | 10 | 16 |
| 2012 | 7 | 18 |
| 2013 | 19 | 36 |
| 2014 | 27 | 37 |
| 2015 | 33 | 41 |
| 2016 | 44 | 26 |
| 2017 | 33 | 31 |
| 2018 | 47 | 53 |
| 2019 | 54 | 54 |
| 2020 | 41 | 43 |
| 2021 | 30 | 40 |
| 2022 | 33 | 38 |
| 2023 | 30 | 63 |
| 2024 | 39 | 40 |
| 2025 | 38 | 60 |
| 2026 | 20 | 37 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Resistor structure in integrated circuit25 Aug 2026US 12,720,777 B2International Business Machines Corporation
- Co-integration of gate-all-around nanosheet logic device and precision mol resistor11 Aug 2026US 12,707,656 B2International Business Machines Corporation
- Thin film resistor11 Aug 2026US 12,707,657 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit with silicide formation blocking11 Aug 2026US 12,707,694 B2Texas Instruments Incorporated
- Heterogeneous metal line compositions for advanced integrated circuit structure fabrication11 Aug 2026US 12,707,697 B2Intel Corporation
- Semiconductor structure having low-resistance via contact8 Oct 2026US 2026/0314396 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device and methods of formation17 Sep 2026US 2026/0282523 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Serpentine structure for thin film resistors and a method of fabricating the same10 Sep 2026US 2026/0271705 A1Samsung Electronics Co., Ltd.
- Semiconductor integrated circuit13 Aug 2026US 2026/0239633 A1Rohm Co., Ltd.
- Semiconductor device23 Jul 2026US 2026/0214919 A1Rohm Co., Ltd.
Most cited
By later US patents
- Method for forming high resistance resistors for limiting cathode current in field emission displays81US 5,585,301 AMicron Display Technology, Inc. · 1996
- Thin film resistor for an integrated circuit semiconductor device74US 4,609,903 AFujitsu Limited · 1986
- Reversible electric fuse and antifuse structures for semiconductor devices67US 7,557,424 B2International Business Machines Corporation · 2009
- Method for forming a thin-film resistor56US 6,272,736 B1United Microelectronics Corp. · 2001
- Use of barrier refractive or anti-reflective layer to improve laser trim characteristics of thin film resistors53US 6,259,151 B1Intersil Corporation · 2001