H05K 7/1046
J-shaped leads
Official title: {J-shaped leads}
H05K7/1046 (J-shaped leads) appears on 61 US grants and 9 published applications in this corpus.
Search patents in H05K- Granted patents
- 61
- Published applications
- 9
- Assignees
- 26
- Inventors
- 85
- Latest grant
- 17 Jun 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 8 | 0 |
| 1988 | 4 | 0 |
| 1989 | 4 | 0 |
| 1990 | 3 | 0 |
| 1991 | 3 | 0 |
| 1992 | 5 | 0 |
| 1993 | 7 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 3 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 1 |
| 2005 | 0 | 0 |
| 2006 | 1 | 1 |
| 2007 | 1 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 1 | 2 |
| 2011 | 1 | 1 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 2 |
| 2015 | 0 | 0 |
| 2016 | 1 | 1 |
| 2017 | 0 | 0 |
| 2018 | 2 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 1 |
| 2024 | 0 | 0 |
| 2025 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Leaded semiconductor device package having leads with different widths17 Jun 2025US 12,334,417 B2Texas Instruments Incorporated
- Wiring substrate and manufacturing method thereof22 May 2018US 9,980,364 B2Yazaki Corporation
- Wiring substrate and manufacturing method thereof6 Feb 2018US 9,888,558 B2Yazaki Corporation
- Wiring substrate and manufacturing method thereof25 Oct 2016US 9,480,142 B2Yazaki Corporation
- Connection base assembly for an IC testing apparatus7 Jun 2011US 7,955,092 B2
- Leaded semiconductor device package2 Mar 2023US 2023/0068748 A1Texas Instruments Incorporated
- Wiring substrate and manufacturing method thereof14 Jul 2016US 2016/0205763 A1Yazaki Corporation
- Wiring substrate and manufacturing method thereof18 Sep 2014US 2014/0262451 A1Yazaki Corporation
- Wiring substrate and manufacturing method thereof18 Sep 2014US 2014/0268581 A1Yazaki Corporation
- Wiring substrate and manufacturing method thereof8 Dec 2011US 2011/0299250 A1Yazaki Corporation
Most cited
By later US patents
- Socket for stacking integrated circuit packages108US 4,696,525 AAMP Incorporated · 1987
- Connector for connecting a circuit element to the surface of a substrate66US 4,089,575 AAMP Incorporated · 1978
- Dual-in-line package assembly59US 4,406,508 AThomas & Betts Corporation · 1983
- Socket for an integrated circuit chip carrier and method for packaging an integrated circuit chip55US 4,918,513 ASeiko Epson Corporation · 1990
- Chip carrier socket having improved contact terminals43US 4,645,279 AAMP Incorporated · 1987