Socket for stacking integrated circuit packages
AssigneeAMP Incorporated
InventorsJames R. Coller, Joseph R. Goodman
Life of this patent
Estimating the term…
Abstract
A socket for stacking and interconnecting corresponding leads of two integrated circuit packages having the contacts stamped and formed in a lead frame configuration with a dielectric body molded over a portion of the terminal ends. Two contact halves are sheared from the opposite end of the terminal, one contact formed upwardly while the second contact is formed downwardly. Integrated circuit package leads can be selectively commoned by jumpering the terminal ends prior to molding the body.
Claims17
A socket for interconnecting two integrated circuit packages, each having a plurality of package leads extending from opposite sides, the socket comprising means for stacking the two integrated circuit packages and commoning package leads, the socket further comprising:
- a central body, and
- a plurality of socket leads, each lead comprising a central portion lying along a central plane common with all central portions, each central portion being partially embedded within the body and extending therefrom, and two contact arms extending from the associated central portion, the arms extending in opposite directions from the plane of the central portion, a first plurality of contact arms extending upwardly and transversely of the central plane establishing a first socket, and a second plurality of contact arms extending downwardly and transversely of the central plane to establish a second socket, whereby
- the contact arms interconnect the package leads of the integrated circuit packages, one package disposed above and one package disposed below the socket body.
A socket for interconnecting two integrated circuit packages, each having a plurality of package leads extending from the sides thereform, the socket comprising means for stacking the two integrated circuit packages and commoning package leads, the socket further comprising:
- a central body, and
- a lead frame forming a plurality of stamped and formed socket leads, each socket lead comprising a central portion lying along a central plane common with all central portions, each central portion being partially embedded within the body and extending therefrom, and two contact arms extending from the associated central portion formed in opposite directions from the plane of the lead frame defining a first plurality of contact arms formed upwardly and transversely of the central plane establishing a first socket, and a second plurality of contact arms formed downwardly and transversely of the central plane establishing a second socket, whereby
- the contact arms interconnect the package leads of the integrated circuit packages, one package disposed above and one package disposed below the socket body.
A socket for interconnecting two integrated circuit packages, each package having a plurality of package leads extending from opposite sides, the socket comprising means for stacking the two integrated circuit packages and commoning package leads, the socket further comprising:
- a contact lead frame having two parallel opposed rows of terminals, each terminal having a central portion lying in a central parallel plane adjacent to central portions in the opposed row and at least one jumper portion electrically interconnecting a central portion of one row with a central portion of the opposite row, and two contact arms extending from each central portion, one arm formed upwardly and transversely of the central parallel plane and one arm formed downwardly and transversely of the central parallel plane,
- and a central body molded over the central portion of the terminals, encapsulating the central portions therein, whereby the contact arms interconnect the package leads of the integrated circuit packages, one package disposed above and one package disposed below the socket body.
Dependencies are inferred from the claim text.