Leaded semiconductor device package having leads with different widths

An apparatus, comprising:

• a leaded semiconductor device package adapted to be surface mounted to a printed circuit board and having leads exposed from a mold compound, the leads adapted to be soldered to pads on the printed circuit board;
• the leaded semiconductor device package further comprising:
• a package substrate having a die pad and leads spaced from the die pad;
• a semiconductor die mounted to die pad, the semiconductor die having bond pads;
• electrical connections coupling the bond pads of the semiconductor die to the leads;
• the mold compound covering a portion of the package substrate, the semiconductor die, and the electrical connections, with the leads extending through the mold compound and having end portions exposed from the mold compound;
• and
• the end portions exposed from the mold compound including a first portion with a first width and extending with the first width from the mold compound to a second portion including a second width that is greater than the first width, wherein the leads end with an edge including the second width.

A method, comprising:

• mounting a semiconductor die to a die pad of a package substrate, the package substrate having leads spaced from the die pad, the leads having a first portion with a first width and extending with the first width to a second portion with a second width greater than the first width wherein the leads end with an edge including the second width;
• forming electrical connections coupling the bond pads of the semiconductor die to the conductive leads;
• covering a portion of the package substrate, the semiconductor die, and the electrical connections with mold compound, with the first portion and the second portion of the leads extending from and exposed from the mold compound;
• and
• bending the leads in the first portion forming a bend outside a package body formed by the mold compound, the leads extending from the bend towards a board side surface of a package body formed by the mold compound.