Wiring substrate and manufacturing method thereof

A method of manufacturing a wiring substrate including a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components, a connection terminal extended from the high heat radiation substrate and bending in a direction perpendicular to a surface of the substrate, and a heat radiation piece section which is integrally formed to the connection terminal, the method comprising:

• a substrate forming process of stacking insulation layers on front and rear surfaces of a conductive metal plate which becomes the connection terminal to form the substrate;
• a metal plate exposing process of removing the insulation layers in a part of the substrate to expose the metal plate;
• and
• a connection terminal forming process of processing the exposed metal plate to form the connection terminal in which the heat radiation piece section protrudes in a side direction.

A wiring substrate comprising:

• a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components;
• a window section formed in the substrate;
• and
• a connection terminal extended from an inside surface portion of the window section and bending in a direction perpendicular to a surface of the substrate.

A method of manufacturing a wiring substrate which includes a substrate having a high thermal conductive layer in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components, a window section formed on the substrate, and a connection terminal which is extended from an inside surface portion of the window section and bent in a direction perpendicular to a surface of the substrate, the method comprising:

• a substrate forming process of stacking insulation layers on front and rear surfaces of a conductive metal plate which becomes the connection terminal to form the substrate;
• a metal plate exposing process of removing the insulation layers from a portion of the substrate in which the window section is to be formed, to expose the conductive metal plate;
• and
• a connection terminal forming process of processing the exposed conductive metal plate to form the window section and the connection terminal.

A wiring substrate, comprising:

• a substrate in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components;
• a concave section formed in at least one side edge part of the substrate;
• and
• a connection terminal extended from a side surface portion of the concave section and bent in a direction perpendicular to a surface of the substrate, wherein the connection terminal is disposed inside a side surface of the substrate.

A method of manufacturing a wiring substrate including a substrate in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components, a concave section which is formed in at least one side edge part of the substrate, and a connection terminal which is extended from a side surface portion of the concave section and bent in a direction perpendicular to a surface of the substrate, the method comprising:

• a substrate forming process of stacking insulation layers on the front and rear of a conductive metal plate which becomes the connection terminal to form the substrate;
• a metal plate exposing process of removing the insulation layers in a portion of the substrate in which the concave section is to be formed, to expose the metal plate;
• and
• a connection terminal forming process of processing the exposed metal plate to form the concave section and the connection terminal.