Connector for connecting a circuit element to the surface of a substrate

Abstract

A two part connector system for connecting a circuit element such as an integrated circuit chip to the surface of a printed circuit board in which the first connector section, e.g., a chip carrier, which holds the circuit chip, has resilient, spring-like external terminals which can be connected directly and permanently on the printed circuit board surface, as by soldering, without appreciable risk of breakage of said connections because of different expansion and contraction coefficients of the chip carrier and the printed circuit board or, alternatively, the chip carrier can be removably mounted in the second connector section, e.g., a socket, which also has resilient, spring-like external terminals connectable permanently to the surface of the printed circuit without appreciable risk of breakage of said connections because of different expansion and contraction coefficients of the socket and the circuit board. Such a two-part connector structure enables a ceramic encapsulated circuit chip having a first coefficient of thermal expansion to be safely and advantageously mounted on a plastic printed circuit board having a substantially different coefficient of thermal expansion. Economies of space and higher frequency capabilities are obtained by the structure of the invention over that obtainable by conventional dual in-line packaging techniques.

Dependencies are inferred from the claim text.