Socket for an integrated circuit chip carrier and method for packaging an integrated circuit chip
AssigneeSeiko Epson Corporation
InventorsMitsukazu Kurose, Masahiro Minowa
Life of this patent
Estimating the term…
Abstract
An IC chip socket for receiving an IC bare chip carrier includes a guide member for guiding the periphery of the IC chip carrier. The guide member supports a plurality of connector pins having one end projecting within the guide member and another end projecting without the guide member. The connector pins electrically connect the electrodes of the chip carrier to the electronic circuit substrate. The respective ends of the connector pins projecting within the guide member are brought into contact with the electrodes of the IC chip carrier. The ends of the connector pins which project without the guide member are connectable with the electrodes mounted on the surface of the electronic circuit substrate.
Claims29
A device for fixedly packaging an interchangeable IC on an electronic circuit substrate comprising:
- a chip carrier substrate upon which the IC is mounted, the chip carrier substrate having electrodes on the surface thereof;
- an IC bearing chip mounted on the chip carrier substrate and electrically connected with said electrode pattern;
- and
- an IC chip socket comprising a guide member formed with a central opening for receiving at least a portion of the chip carrier substrate and a plurality of connector pins supported by the guide member, each having one end extending within the central opening of the guide member for contact with and electrically coupling with the electrodes of the chip carrier substrate and a second end extending outside the guide member extending in a substantially transverse direction relative to the guide member for coupling to the electronic circuit substrate;
- whereby the chip carrier substrate is changeably mounted and the IC chip socket is surface mountable on the electronic circuit substrate.
A device for fixedly packaging an interchangeable IC on an electronic circuit substrate comprising:
- a chip carrier substrate upon which the IC is mounted, the chip carrier substrate having electrodes on the surface thereof;
- an IC bearing chip mounted on the chip carrier substrate and electrically connected with said electrode pattern;
- and
- an IC chip socket comprising a guide member formed with a central opening for receiving at least a portion of the chip carrier substrate and a plurality of connector pins supported by the guide member each having one end extending within the central opening of the guide member for contact with and electrically coupling with the electrodes of the chip carrier substrate and a second end extending outside the guide member for coupling to the electronic circuit substrate the connector pins being made of resilient material, and the ends of the connector pins projecting within the guide member are disposed opposed to the electrodes arranged on the surface of the chip carrier to bias the chip carrier to retain the chip carrier in the guide member;
- whereby the chip carrier substrate is changeably mounted and the IC chip socket is surface mountable on the electronic circuit substrate.
An IC chip socket for fixedly mounting an interchangeable IC chip carrier utilized for packaging a chip carrier to an electronic circuit substrate, the IC chip carrier having electrodes on the surface thereof, comprising:
- a guide member formed with a central opening for receiving at least a portion of the chip carrier;
- and
- a plurality of connector pins supported by the guide member, each having one end extending within the central opening of the guide member for coupling with the electrodes of the chip carrier and a second end extending outside extending in a substantially transverse direction relative to the guide member, whereby the chip carrier is changeably mountable in the IC chip socket and the chip socket is surface mountable on an electronic circuit substrate.
An IC chip socket for fixedly mounting an interchangeable IC chip carrier utilized for packaging a chip carrier to an electronic circuit substrate, the IC chip carrier having electrodes on the surface thereof, comprising:
- a guide member formed with a central opening for receiving at least a portion of the chip carrier;
- and
- a plurality of connector pins supported by the guide member, each having one end extending within the central opening of the guide member for coupling with the electrodes of the chip carrier and a second end extending outside the guide member, whereby the chip carrier is changeably mountable in the IC chip socket and the chip socket is surface mountable on an electronic circuit substrate the connector pins being made of a resilient material, and the ends of the connector pins projecting within the guide member being disposed opposed to the electrodes arranged on the surface of the chip carrier to bias the chip carrier to retain the chip carrier in the guide member.
An IC chip socket for fixedly mounting on an electronic circuit substrate an interchangeable lead-less IC chip carrier having a plurality of electrodes on the surface thereof, comprising:
- a guide member formed with an internal opening for receiving and guiding the periphery of the IC chip carrier;
- a plurality of connector pins supported by the guide member for electrically connecting the electrodes of the chip carrier with the electronic circuit substrate when the chip carrier is positioned within the guide member, each connector pin having an end extending within the opening in the guide member and an end extending outside the guide member;
- a lower abutment member provided on the inner surface of the opening of the guide member for preventing damage to the connector pins when attaching the IC chip carrier while permitting the ends of the connector pins within the opening in the guide member to engage the electrodes in the surface of the chip carrier;
- and
- an upper abutment member for securing the IC chip carrier between the upper abutment member and the connector pins, wherein the connector pins bias the IC chip towards the upper abutment member, and the lower abutment member and the upper abutment member are integrally formed with the guide member.
Dependencies are inferred from the claim text.