Dual-in-line package assembly
AssigneeThomas & Betts Corporation
InventorAmir-Akbar Sadigh-Behzadi
Life of this patent
Estimating the term…
Abstract
A dual-in-line package assembly for interconnection with a printed circuit board includes a base having a plurality of free-standing contacts and a DIP carrier having channels extending therethrough for jointly receiving DIP lead and base contacts and for biasing resililent portions of the base contacts upon the DIP leads interiorly of the carrier. The channels of carriers stacked in the assembly have common base contacts passing therethrough in registry with a lead of each stacked package.
Claims9
An electronic package assembly, comprising:
- (a) a base having a support surface and a plurality of contacts supported thereon in preselected mutual spacing, each said contact defining first and second resilient contact portions successively distal from said support surface;
- and
- (b) first and second electronic package carriers stackably received by said base and respectively registrable with said first and second contact resilient portions, each such carrier and said base defining cooperative surfaces for polarized receipt of said first and second package carriers by said base, each such carrier having connection-effecting means for boundingly jointly receiving the leads of a package carried thereby and said base contacts, and for individually biasing said contact resilient portions registered therewith into engagement with said package leads interiorly of said carriers.
An electronic package assembly, comprising:
- (a) a base having a support surface and a plurality of contacts supported thereon in preselected mutual spacing, each said contact defining first and second resilient contact portions successively distal from said support surface;
- and
- (b) first and second electronic package carriers stackably received by said base and respectively registrable with said first and second contact resilient portions, each such carrier having connection-effecting means for boundingly jointly receiving the leads of a package carried thereby and said base contacts, and for individually biasing said contact resilient portions registered therewith into engagement with said package leads interiorly of said carriers, said second package carrier and said base jointly providing detent means independently of said package leads and said base contacts for retention of said first and second carriers in said base.
An electronic package assembly, comprising:
- (a) an electronic component package having a plurality of spaced leads depending outwardly along a side of said package;
- (b) a carrier defining a support surface for said package and a plurality of channels mutually spaced correspondingly with such lead spacing and adapted for individually receiving said leads, and an outer wall of preselected thickness partially bounding each said channel, said channels being disposed between such carrier wall and said support surface;
- and
- (c) an upstanding base having a support surface for said carrier, a plurality of contacts extending upwardly beyond said support surface and mutually spaced correspondingly with said channels for entering same, and an outer wall having its interior surface spaced from said contacts by a measure exceeding said preselected carrier wall thickness, whereby said package may be assembled with said carrier with said leads disposed in said channels and said carrier then insertable in said housing, said contacts thereupon entering said channels and electrically engaging said leads.
Dependencies are inferred from the claim text.