Wiring substrate and manufacturing method thereof

A method of manufacturing a wiring substrate including a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components, a connection terminal extended from the substrate and bending in a direction perpendicular to a surface of the substrate, and a heat radiation piece section which is integrally formed to the connection terminal, the method comprising:

• a substrate forming process of stacking insulation layers on front and rear surfaces of a conductive metal plate which becomes the connection terminal to form the substrate;
• a metal plate exposing process of removing the insulation layers in a part of the substrate to expose the metal plate;
• and
• a connection terminal forming process of processing the exposed metal plate to form the connection terminal in which the heat radiation piece section protrudes in a side direction.