H05K 7/10
Plug-in assemblages of components
Official title: Plug-in assemblages of components {, e.g. IC sockets}
H05K7/10 (Plug-in assemblages of components) appears on 3,046 US grants and 1,737 published applications in this corpus.
Search patents in H05K- Granted patents
- 3,046
- Published applications
- 1,737
- Assignees
- 647
- Inventors
- 3,233
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 24 | 0 |
| 1977 | 26 | 0 |
| 1978 | 14 | 0 |
| 1979 | 9 | 0 |
| 1980 | 17 | 0 |
| 1981 | 14 | 0 |
| 1982 | 26 | 0 |
| 1983 | 35 | 0 |
| 1984 | 33 | 0 |
| 1985 | 65 | 0 |
| 1986 | 39 | 0 |
| 1987 | 58 | 0 |
| 1988 | 42 | 0 |
| 1989 | 46 | 0 |
| 1990 | 35 | 0 |
| 1991 | 72 | 0 |
| 1992 | 56 | 0 |
| 1993 | 57 | 0 |
| 1994 | 73 | 0 |
| 1995 | 59 | 0 |
| 1996 | 64 | 0 |
| 1997 | 80 | 0 |
| 1998 | 90 | 0 |
| 1999 | 70 | 0 |
| 2000 | 105 | 0 |
| 2001 | 105 | 37 |
| 2002 | 112 | 94 |
| 2003 | 100 | 111 |
| 2004 | 137 | 119 |
| 2005 | 113 | 155 |
| 2006 | 116 | 89 |
| 2007 | 106 | 102 |
| 2008 | 96 | 147 |
| 2009 | 104 | 114 |
| 2010 | 132 | 113 |
| 2011 | 109 | 59 |
| 2012 | 58 | 52 |
| 2013 | 41 | 56 |
| 2014 | 45 | 67 |
| 2015 | 61 | 40 |
| 2016 | 59 | 48 |
| 2017 | 36 | 36 |
| 2018 | 48 | 44 |
| 2019 | 44 | 54 |
| 2020 | 47 | 27 |
| 2021 | 30 | 36 |
| 2022 | 39 | 42 |
| 2023 | 24 | 39 |
| 2024 | 27 | 27 |
| 2025 | 30 | 19 |
| 2026 | 18 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Circuit board of graphics processing unit and server system22 Sep 2026US 12,743,390 B2Suzhou Metabrain Intelligent Technology Co., Ltd.
- Control housing system and self-driving vehicle having a control housing system22 Sep 2026US 12,744,364 B2KUKA Deutschland GmbH
- Electronic device with pluggable front end module15 Sep 2026US 12,738,959 B2Hewlett Packard Enterprise Development LP
- Shielded socket pin for device-to-device connection11 Aug 2026US 12,706,407 B2Intel Corporation
- Automation field device11 Aug 2026US 12,707,586 B2Endress + Hauser GmbH + Co. KG
- Converter tower with electromagnetic interference suppressor, and converter installation1 Oct 2026US 2026/0304665 A1Siemens Energy Global GmbH & Co. KG
- Latch mechansim for releasably securing riser card assembly1 Oct 2026US 2026/0304666 A1Aivres Systems Inc.
- Electronic assembly including a connecting fork13 Aug 2026US 2026/0239586 A1Valeo eAutomotive Germany GmbH
- Conductive polymer enhanced socket30 Apr 2026US 2026/0122814 A1Advanced Micro Devices, Inc.
- Electrical connector16 Apr 2026US 2026/0106391 A1Sichuan Huafeng Technology Co., Ltd.
Most cited
By later US patents
- Module for a computer interface473US 6,780,156 B2Disetronic Licensing AG · 2004
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999