H05K 7/1092
With built-in components
Official title: {with built-in components, e.g. intelligent sockets}
H05K7/1092 (With built-in components) appears on 215 US grants and 145 published applications in this corpus.
Search patents in H05K- Granted patents
- 215
- Published applications
- 145
- Assignees
- 100
- Inventors
- 360
- Latest grant
- 28 Oct 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 2 | 0 |
| 1985 | 4 | 0 |
| 1986 | 5 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 3 | 0 |
| 1994 | 0 | 0 |
| 1995 | 6 | 0 |
| 1996 | 10 | 0 |
| 1997 | 4 | 0 |
| 1998 | 9 | 0 |
| 1999 | 11 | 0 |
| 2000 | 4 | 0 |
| 2001 | 3 | 4 |
| 2002 | 11 | 22 |
| 2003 | 15 | 26 |
| 2004 | 14 | 13 |
| 2005 | 22 | 14 |
| 2006 | 8 | 10 |
| 2007 | 10 | 6 |
| 2008 | 8 | 10 |
| 2009 | 5 | 1 |
| 2010 | 5 | 3 |
| 2011 | 3 | 2 |
| 2012 | 2 | 2 |
| 2013 | 2 | 4 |
| 2014 | 3 | 1 |
| 2015 | 4 | 4 |
| 2016 | 4 | 6 |
| 2017 | 2 | 0 |
| 2018 | 2 | 3 |
| 2019 | 2 | 1 |
| 2020 | 1 | 1 |
| 2021 | 1 | 2 |
| 2022 | 3 | 4 |
| 2023 | 1 | 3 |
| 2024 | 2 | 2 |
| 2025 | 4 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Removable OCP module with PCIe slots28 Oct 2025US 12,457,700 B2Hewlett Packard Enterprise Development LP
- Carrier module apparatus for retrofit in control cabinets and methods of assembly thereof22 Jul 2025US 12,369,267 B2ABB Schweiz AG
- Structure and structure with electronic component17 Jun 2025US 12,336,085 B2Murata Manufacturing Co., Ltd.
- Reverse clamping compression device for CPO or NPO8 Apr 2025US 12,271,045 B2Celestica Technology Consultancy (Shanghai) Co. Ltd
- Electronic assembly including cable modules10 Sep 2024US 12,089,357 B2TE Connectivity Solutions GmbH
- Removable ocp module with pcie slots21 Aug 2025US 2025/0267815 A1Hewlett Packard Enterprise Development LP
- Integrated circuit packages including carriers with incorporated substrates and interfaces24 Oct 2024US 2024/0357744 A1Intel Corporation
- Reverse clamping compression device for cpo or npo22 Feb 2024US 2024/0061196 A1Celestica Technology Consultancy (Shanghai) Co. Ltd
- Carrier module apparatus for retrofit in control cabinets and methods of assembly thereof5 Oct 2023US 2023/0320017 A1ABB Schweiz AG
- Structure and structure with electronic component3 Aug 2023US 2023/0247756 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- CPU socket supporting socket-to-socket optical communications141US 4,953,930 ARamtech, Inc. · 1990
- Adapter for connection of an integrated circuit package to a circuit board138US 5,168,432 AAdvanced Interconnections Corporation · 1992
- Integrated socket with chip carrier93US 6,381,283 B1ControlNet, Inc. · 2002
- Multi-portion socket and related apparatuses91US 6,971,887 B1Intel Corporation · 2005
- Method and apparatus for cooling an integrated circuit device89US 6,054,676 AKryotech, Inc. · 2000