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US 2024/0357744 A1Published application
Integrated circuit packages including carriers with incorporated substrates and interfaces
AssigneeIntel Corporation
InventorsRick Canham, Jeffory L. Smalley, Steven Adam Klein, Shelby Ann Ferguson
Life of this patent
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Abstract
Integrated circuit packages including carriers with incorporated substrates and interfaces are disclosed herein. An integrated circuit package carrier disclosed herein includes a frame including an opening to receive an integrated circuit package and at least one of (1) a circuitry component on a substrate on a surface of the frame or (2) a cable interface directly coupled to the frame.
Claims20
An integrated circuit package carrier comprising:
- a frame including an opening to receive an integrated circuit package;
- and
- at least one of (a) a circuitry component on a substrate on a surface of the frame or (a) a cable interface directly coupled to the frame.
An apparatus including:
- an integrated circuit package to be coupled to a socket;
- a heat sink thermally coupled to the integrated circuit package;
- and
- a carrier clip adjacent to the heat sink, the carrier clip including:
- a frame receiving the integrated circuit package;
- and
- at least one of (a) a circuitry component on a substrate coupled to a surface of the frame or (b) a cable interface.
4 more elements
An electronic device including:
- a printed circuit board including a socket;
- an integrated circuit package to be coupled to the socket;
- a heat sink thermally coupled to the integrated circuit package;
- and
- a carrier adjacent to the heat sink, the carrier including:
- a frame including an opening, the integrated circuit package disposed in the opening;
- and
- at least one of (1) a circuitry component on a substrate coupled to a surface of the frame or (2) a cable interface.
5 more elements
Dependencies are inferred from the claim text.