Intel Corporation
Santa Clara, unknown· latest recorded location
Intel Corporation is named on 127 US grants and 2,370 published applications in this corpus. Its most frequent classification is G06F (Computing and data processing).
- Granted patents
- 127
- Published applications
- 2,370
- Inventors
- 3,104
- Granted in 2026 so far
- 2
- Most recent grant
- 16 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 13 |
| 2002 | 2 | 111 |
| 2003 | 3 | 283 |
| 2004 | 0 | 326 |
| 2005 | 0 | 435 |
| 2006 | 0 | 429 |
| 2007 | 6 | 405 |
| 2008 | 12 | 108 |
| 2009 | 4 | 64 |
| 2010 | 3 | 43 |
| 2011 | 6 | 40 |
| 2012 | 7 | 13 |
| 2013 | 2 | 7 |
| 2014 | 4 | 10 |
| 2015 | 12 | 12 |
| 2016 | 8 | 14 |
| 2017 | 5 | 16 |
| 2018 | 7 | 12 |
| 2019 | 5 | 3 |
| 2020 | 7 | 7 |
| 2021 | 0 | 10 |
| 2022 | 8 | 5 |
| 2023 | 4 | 2 |
| 2024 | 9 | 0 |
| 2025 | 5 | 0 |
| 2026 | 2 | 2 |
By publication year. 2026 runs to 8 Oct.
Technology areas
Share of 2,497 documents
- G06FComputing and data processing776
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by432
- H04LDigital communication414
- H05KPrinted circuits209
- H04WWireless communication networks192
- Y10TTechnical subjects covered by former us classification162
- Y02DClimate change mitigation technologies in information and communication technologies [ict], i.e. information120
- G11CStatic stores117
- H04BTransmission91
- H10DInorganic electric semiconductor devices88
Recent patents
- Packaging architecture with thermally conductive integrated circuit bridge16 Jun 2026US 12,660,684 B2
- Systems and methods to edit videos to remove and/or conceal audible commands31 Mar 2026US 12,592,259 B2
- Delayed cache writeback instructions for improved data sharing in manycore processors17 Jun 2025US 12,333,305 B2
- Integrated circuit package having wirebonded multi-die stack25 Feb 2025US 12,237,305 B2
- Lateral gate material arrangements for quantum dot devices18 Feb 2025US 12,230,687 B2
- Dynamic memory sharing between xpus based on system heuristics and real time adjustments30 Apr 2026US 2026/0119389 A1
- Processors, methods, and systems fetch and decode at least two in-order sequences of instructions in parallel1 Jan 2026US 2026/0003622 A1
- Hardware connector pin reduction for expansion slot interfaces4 May 2023US 2023/0138265 A1
- Vector processor utilizing massively fused operations5 Jan 2023US 2023/0004389 A1
- Processor embedded streaming buffer29 Dec 2022US 2022/0413852 A1
Most cited
By later US patents
- Slurries for chemical mechanical polishing268US 5,340,370 A1994
- Variable stage charge pump105US 5,767,735 A1998
- Method and apparatus for protecting flash memory62US 6,363,463 B12002
- Three-dimensional browsing of multiple video sources46US 5,963,215 A1999
- Method for making a semiconductor device having a low-k dielectric layer38US 6,362,091 B12002