Shielded socket pin for device-to-device connection
AssigneeIntel Corporation
InventorsLandon Hanks, Xiang Li, George Vergis, James A. McCall
Life of this patent
Estimating the term…
Abstract
Examples described herein relate to a system that includes: a first signal pin and a first ground pin adjacent to the first signal pin. In some examples, the first signal pin comprises a first portion, a second portion, and a third portion. In some examples, the first ground pin comprises a first portion, a second portion, and a third portion, the second portion of the first signal pin comprises a vertical mount, the second portion of the first ground pin comprises a vertical mount, and the second portion of the first signal pin and the second portion of the first ground pin are arranged proximate one another.
Claims17
An apparatus comprising:
- a first signal pin and
- a first ground pin adjacent to the first signal pin, wherein:
- the first signal pin comprises a first portion, a second portion, and a third portion,
- the first ground pin comprises a first portion, a second portion, and a third portion,
- the second portion of the first signal pin comprises a vertical mount and a cantilever mount segment,
- the second portion of the first ground pin comprises a vertical mount and a cantilever mount segment,
- the cantilever mount segment of the first signal pin and the cantilever mount segment of the first ground pin are arranged proximate, adjacent, and mirror one another,
- the first portion of the first signal pin comprises a soldering portion, and
- the third portion of the first signal pin comprises spring load.
A system comprising:
- a first device comprising a motherboard;
- a second device comprising a processor package;
- and
- an arrangement of a pair of a signal pin and a ground pin coupled to the motherboard and the processor package, wherein:
- the signal pin comprises a first portion, a second portion, and a third portion,
- the ground pin comprises a first portion, a second portion, and a third portion,
- the second portion of the signal pin comprises a vertical mount and a cantilever mount segment,
- the second portion of the ground pin comprises a vertical mount and a cantilever mount segment,
- the cantilever mount segment of the signal pin and the cantilever mount segment of the ground pin are arranged proximate, adjacent, and mirror one another,
- the first portion of the signal pin comprises a soldering portion, and the third portion of the signal pin comprises spring load.
Dependencies are inferred from the claim text.