H05K 7/1007
With means for increasing contact pressure at the end of engagement of
Official title: {with means for increasing contact pressure at the end of engagement of coupling parts}
H05K7/1007 (With means for increasing contact pressure at the end of engagement of) appears on 483 US grants and 230 published applications in this corpus.
Search patents in H05K- Granted patents
- 483
- Published applications
- 230
- Assignees
- 119
- Inventors
- 534
- Latest grant
- 14 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 3 | 0 |
| 1981 | 2 | 0 |
| 1982 | 4 | 0 |
| 1983 | 8 | 0 |
| 1984 | 2 | 0 |
| 1985 | 12 | 0 |
| 1986 | 2 | 0 |
| 1987 | 7 | 0 |
| 1988 | 7 | 0 |
| 1989 | 13 | 0 |
| 1990 | 3 | 0 |
| 1991 | 12 | 0 |
| 1992 | 4 | 0 |
| 1993 | 6 | 0 |
| 1994 | 6 | 0 |
| 1995 | 10 | 0 |
| 1996 | 12 | 0 |
| 1997 | 14 | 0 |
| 1998 | 10 | 0 |
| 1999 | 8 | 0 |
| 2000 | 26 | 0 |
| 2001 | 34 | 12 |
| 2002 | 41 | 21 |
| 2003 | 34 | 15 |
| 2004 | 38 | 32 |
| 2005 | 15 | 11 |
| 2006 | 15 | 5 |
| 2007 | 6 | 7 |
| 2008 | 9 | 15 |
| 2009 | 8 | 13 |
| 2010 | 22 | 21 |
| 2011 | 18 | 10 |
| 2012 | 7 | 5 |
| 2013 | 6 | 6 |
| 2014 | 4 | 7 |
| 2015 | 4 | 3 |
| 2016 | 4 | 2 |
| 2017 | 8 | 8 |
| 2018 | 6 | 9 |
| 2019 | 4 | 7 |
| 2020 | 8 | 2 |
| 2021 | 2 | 5 |
| 2022 | 7 | 3 |
| 2023 | 5 | 3 |
| 2024 | 1 | 6 |
| 2025 | 2 | 2 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Power conversion device using PCB's14 Apr 2026US 12,603,575 B2Mitsubishi Electric Corporation
- Test socket connector having latch with a bottom guiding portion10 Jun 2025US 12,326,461 B2Foxconn Interconnect Technology Limited
- Reverse clamping compression device for CPO or NPO8 Apr 2025US 12,271,045 B2Celestica Technology Consultancy (Shanghai) Co. Ltd
- Assembly method of electronic device17 Sep 2024US 12,096,568 B2Inventec Corporation
- Electrical connector assembly including a back plate having a curved inner region and a flat outer region28 Nov 2023US 11,831,094 B2Foxconn Interconnect Technology Limited
- Motion body and coupling method thereof27 Feb 2025US 2025/0071932 A1Fivegrand International Co., Ltd.
- Methods and apparatus to improve thermal dissipation and mechanical loading of integrated circuit packages9 Jan 2025US 2025/0014967 A1Intel Corporation
- Systems and methods for test sockets having scrubbing contacts28 Nov 2024US 2024/0393364 A1
- Reusable member for retaining electronic card8 Aug 2024US 2024/0268050 A1Amphenol Commercial Products (ChengDu) Co.LTD
- Power Conversion Device13 Jun 2024US 2024/0195307 A1Mitsubishi Electric Corporation
Most cited
By later US patents
- Zero insertion force connector140US 4,402,563 AAries Electronics, Inc. · 1983
- Electrical connector129US 4,815,987 AFujitsu Limited · 1989
- Zero insertion force socket129US 5,254,012 AIndustrial Technology Research Institute · 1993
- Terminal of socket connector103US 6,461,183 B1Hon Hai Precision Ind.Co., Ltd. · 2002
- Dip socket having preloading and antiwicking features98US 4,217,024 ABurroughs Corporation · 1980